This book includes original, peer-reviewed research papers from the 15th China Academic Conference on Printing and Packaging (CACPP 2024), held in Tianjin, China on November 14-16, 2024. The proceedings cover the latest findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, printing and packaging technology, and so on. As such, the book is of interest to university researchers, R&D engineers and graduate students in the fields of color science, image science, materials science, computer science, digital media, network technology, smart manufacturing technology and printing and packaging.

This book includes original, peer-reviewed research papers from the 15th China Academic Conference on Printing and Packaging (CACPP 2024), held in Tianjin, China on November 14-16, 2024. The proceedings cover the latest findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, printing and packaging technology, and so on. As such, the book is of interest to university researchers, R&D engineers and graduate students in the fields of color science, image science, materials science, computer science, digital media, network technology, smart manufacturing technology and printing and packaging.

This book includes original, peer-reviewed research papers from the 15th China Academic Conference on Printing and Packaging (CACPP 2024), held in Tianjin, China on November 14-16, 2024. The proceedings cover the latest findings in color science and technology, image processing technology, digital media technology, mechanical and electronic engineering and numerical control, materials and detection, printing and packaging technology, and so on. As such, the book is of interest to university researchers, R&D engineers and graduate students in the fields of color science, image science, materials science, computer science, digital media, network technology, smart manufacturing technology and printing and packaging.