Amalendu Patnaik – författare

This book presents high-quality papers from the Ninth International Conference on Microelectronics and Telecommunication Engineering (ICMETE 2025). It discusses the latest technological trends and advances in major research areas such as microelectronics, wireless communications, optical communication, signal processing, image processing, big data, cloud computing, artificial intelligence, and sensor network applications. This book includes the contributions of national/international scientists, researchers, and engineers from both academia and industry. The contents of this book will be useful to researchers, professionals, and students alike.

This book discusses the development of promising technologies for compact antennas for high data-rate communications. It discusses and analyzes the design of compact ultra-wideband (UWB) and multiple input, multiple output (MIMO) antennas, providing essential know-how for designers, practicing engineers and scientists.These wireless communication technologies enable consumers to have convenient access to a wide range of services – anytime, anywhere. And the introduction of wireless mobile access points eliminates the limitations to communication imposed by geographical location. The Internet has allowed people to access and share information much more rapidly, but in order to achieve higher data rates with the limited available resources and imposed constraints, wireless communication technology needs to be pushed beyond the physical limits of the propagation channel. This book contributes to achieving this goal.

This book discusses the development of promising technologies for compact antennas for high data-rate communications. It discusses and analyzes the design of compact ultra-wideband (UWB) and multiple input, multiple output (MIMO) antennas, providing essential know-how for designers, practicing engineers and scientists.

These wireless communication technologies enable consumers to have convenient access to a wide range of services – anytime, anywhere. And the introduction of wireless mobile access points eliminates the limitations to communication imposed by geographical location. The Internet has allowed people to access and share information much more rapidly, but in order to achieve higher data rates with the limited available resources and imposed constraints, wireless communication technology needs to be pushed beyond the physical limits of the propagation channel. This book contributes to achieving this goal.

It discusses and analyzes the design of compact ultra-wideband (UWB) and multiple input, multiple output (MIMO) antennas, providing essential know-how for designers, practicing engineers and scientists. These wireless communication technologies enable consumers to have convenient access to a wide range of services – anytime, anywhere.

The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book. The proposed models are validated with the HSPICEsimulations.The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes theeffect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness.

The book provides accurate FDTDmodels for on-chip interconnects, covering most recent advancements inmaterials and design. Furthermore, depending on the geometry and physicalconfigurations, different electrical equivalent models for CNT and GNR basedinterconnects are presented. Based on the electrical equivalent models theperformance comparison among the Cu, CNT and GNR-based interconnects are alsodiscussed in the book. The proposed models are validated with the HSPICEsimulations.

The book introduces the currentresearch scenario in the modeling of on-chip interconnects. It presents thestructure, properties, and characteristics of graphene based on-chipinterconnects and the FDTD modeling of Cu based on-chip interconnects. Themodel considers the non-linear effects of CMOS driver as well as thetransmission line effects of interconnect line that includes couplingcapacitance and mutual inductance effects. In a more realistic manner, theproposed model includes theeffect of width-dependent MFP of the MLGNR whiletaking into account the edge roughness.