Björn Debaillie – författare

In today’s connected world, the demand for mobile communications and instant access to information, anytime and anywhere, has drastically changed the electronics landscape, both consumer and industrial. Novel 5G and 6G systems will enable connectivity in all forms between humans, devices, machines, and any objects. They will provide virtually ubiquitous, ultra-high bandwidth and low latency network access to individual users, as well as to all objects benefiting from being connected. They will be the "eyes and ears" of Artificial Intelligence systems as it will provide real-time data collection and analysis. Such diversity calls for a new paradigm in terms of flexibility, not only related to performance, but also in terms of scalability and cost.5G and 6G communication systems imply a major stake of sovereignty and autonomy for the communication sector and digital infrastructures of the future. All products related to IoT, traffic, and health care, supported by connectivity will benefit the citizens in their daily lives to improve everything from business to private affairs. Together, this will influence society as much as smart phones did in the recent past. It is all about communication and connectivity.This book provides an overview of the latest research results in this field. It is based on the close collaboration in the BEYOND5 project, extended with vision and roadmap insights by European experts leading the 6G development. The BEYOND5 project has built a completely European supply chain for Radio-Frequency Electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Moving forward into higher frequency bands above 100 GHz for 6G, also more disruptive technologies, using heterogeneous integration of CMOS, SOI, and III/V components such as GaN or InP, and advanced packaging techniques will be necessary to realize the objectives of ubiquitous, ultra-high bandwidth and low latency networks.The book bundles the scientific content of the International Workshop on "Technologies enabling future mobile connectivity & sensing" in Lisbon, Portugal 10 September 2023, as part of the ESSCIRC/ESSDERC 2023 European Solid-state Circuits and Devices Conference. Through articles and abstracts, a combined view of experts and practitioners representing academia, research, and industry in the field of wireless communication systems is given. They cover the topics of RF and digital SOI technology development for 5 and 6G, device and substrate characterization, packaging technology, and the realization of full systems including power amplifiers, linearization techniques, beamforming transceivers, access points, and radar detection.

This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications" at the European Microwave Week in Paris, France, on 22 September, 2024.Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.The Open Access version of this book, available at http://www.taylorfrancis.com, has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license.

The advances in industrial edge artificial intelligence (AI) are transforming the way industrial equipment and machines interact with the real world, with other machines and humans during manufacturing processes. These advances allow Industrial Internet of Things (IIoT) and edge devices to make decisions during the manufacturing processes using sensors and actuators.Digital transformation is reshaping the manufacturing industry, and industrial edge AI aims to combine the potential advantages of edge computing (low latency times, reduced bandwidth, distributed architecture, improved trustworthiness, etc.) with the benefits of AI (intelligent processing, predictive solutions, classification, reasoning, etc.).The industrial environments allow the deployment of highly distributed intelligent industrial applications in remote sites that require reliable connectivity over wireless and cellular connections. Intelligent connectivity combines IIoT, wireless/cellular and AI technologies to support new autonomous industrial applications by enabling AI capabilities at the edge and allowing manufacturing companies to improve operational efficiency and reduce risks and costs for industrial applications.There are several critical issues to consider when introducing AI to industrial IoT applications considering training AI models at the edge, the deployment of the AI-trained inferencing models on the target edge hardware platforms, and the benchmarking of solutions compared to other implementations.Next-generation trustworthy industrial AI systems offer dependability in terms of their design, transparency, explainability, verifiability, and standardised industrial solutions can be implemented in various applications across different industrial sectors.New AI techniques such as embedded machine learning (ML) and deep learning (DL), capture edge data, employ AI models, and deploy these in hardware target edge devices, from ultra-low-power microcontrollers to embedded devices, gateways, and on-premises servers for industrial applications. These techniques reduce latency, increase scalability, reliability, and resilience; and optimise wireless connectivity, greatly expanding the capabilities of the IIoT.This book provides an overview of the latest research results and activities in industrial AI technologies and applications, based on the innovative research, developments and ideas generated by the ECSEL JU AI4DI, ANDANTE and TEMPO projects.The authors describe industrial AI's challenges, the approaches adopted, and the main industrial systems and applications to give the reader extensive insight into the technical nature of this field. The chapters provide insightful material on industrial AI technologies and applications.This book is a valuable resource for researchers, post-graduate students, practitioners, and technoloyg developers interested in gaining insight into industrial edge AI, the IIoT, embedded machine and deep learning, new technologies, and solutions to advance intelligent processing at the edge.The Open Access version of this book, available at http://www.taylorfrancis.com, has been made available under a Creative Commons Attribution-Non-Commercial (CC-BY-NC) 4.0 International License.