Cheng Qian – författare

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.

This book introduces a new Model-Based Reliability System Engineering (MBRSE) methodology, including its concept connotation, basic theory and technologies, framework of integrated platform and engineering application cases.