Esyin Chew - Böcker

Fostering Women's Engagement in STEM Through Education: A Cross-Cultural Academic-Industry Journey uniquely intertwines academic rigour with real-world impact, offering a comprehensive exploration of science, technology, engineering, and mathematics (STEM) experiences forged through the Partnership for Innovation in Employability (PIE) programme. The PIE programme, funded by the British Council, is aimed at nurturing innovation and facilitating interaction to enhance employability within educational robotics.This book brings together participating universities and industry partners from across the world to celebrate and share a variety of case studies showcasing the application of STEM education in various settings – from industrial to primary education. It not only illuminates successes, but critically evaluates challenges faced, and concludes with a look to the future for women in STEM education, research, and professional roles.Key features:Offers a comprehensive, global perspective on the challenges and opportunities in promoting gender equality and diversity in STEM fields through education and outreach programmes, featuring case studies from Wales and MalaysiaProvides actionable insights and recommendations for educators, policymakers, and stakeholders to develop and implement effective strategies for bridging the STEM gender gap and fostering inclusivity in educationExplores innovative pedagogical approaches, such as game-based learning using traditional folk games, and the integration of cutting-edge technologies (e.g. collaborative robots) to engage learners from diverse backgroundsThis serves as a key resource for individuals engaged in professions connected to and researching STEM education, especially those dedicated to promoting and enhancing women's involvement in these fields.

The areas covered include: Instrumentation and Control, Automation, Autonomous Systems, Biomechatronics and Rehabilitation Engineering, Intelligent Systems, Machine Learning, Mobile Robotics, Social Robotics and Humanoid Robotics, Sensors and Actuators, and Machine Vision, as well as Signal and Image Processing.