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1 produkter

1. 

   Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging

   Av Shuye Zhang, Guoli Sun

   Inbunden, 2025

   1623 kr

   Lägg i varukorg

   Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges.It's important to be able understand and predict the thermomechanical …