Shuye Zhang is an associate professor at Harbin Institute of Technology, China. He has been working on electronic packaging areas for 15 years. Currently, he is working on heterogeneous integration, 2.5D packaging, and solder joint reliability.Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of various materials.

• Chapter 1: Advanced semiconductor electronic packagingChapter 2: Warpage evolution of TSV wafer based on a hierarchy multiscale analysis methodChapter 3: Investigation on fatigue life of solder joints for 2.5D packaging structuresChapter 4: Molding process simulation of substratesChapter 5: Structural integration simulation under vibration for PBGA packagingChapter 6: Electromigration simulation study of copper interconnects in 3D packagingChapter 7: Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structuresChapter 8: Mechanical response of solder joints under drop impact loads

Shuye Zhang is an associate professor at Harbin Institute of Technology, China. He has been working on electronic packaging areas for 15 years. Currently, he is working on heterogeneous integration, 2.5D packaging, and solder joint reliability.Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of various materials.

• Chapter 1: Advanced semiconductor electronic packagingChapter 2: Warpage evolution of TSV wafer based on a hierarchy multiscale analysis methodChapter 3: Investigation on fatigue life of solder joints for 2.5D packaging structuresChapter 4: Molding process simulation of substratesChapter 5: Structural integration simulation under vibration for PBGA packagingChapter 6: Electromigration simulation study of copper interconnects in 3D packagingChapter 7: Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structuresChapter 8: Mechanical response of solder joints under drop impact loads

Shuye Zhang is an associate professor at Harbin Institute of Technology, China. He has been working on electronic packaging areas for 15 years. Currently, he is working on heterogeneous integration, 2.5D packaging, and solder joint reliability.Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of various materials.

• Chapter 1: Advanced semiconductor electronic packagingChapter 2: Warpage evolution of TSV wafer based on a hierarchy multiscale analysis methodChapter 3: Investigation on fatigue life of solder joints for 2.5D packaging structuresChapter 4: Molding process simulation of substratesChapter 5: Structural integration simulation under vibration for PBGA packagingChapter 6: Electromigration simulation study of copper interconnects in 3D packagingChapter 7: Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structuresChapter 8: Mechanical response of solder joints under drop impact loads