J. Walter Schultze – författare

Driven by the electronics industry, electrochemical technology has rapidly evolved, finding increasing applications in microelectronics, batteries, sensors, materials science, industrial fabrication, corrosion, microbiology, neurobiology and medicine. Electrochemical Microsystem Technologies provides an overview of the technological status; the development of micropatternings and micro-biosensors; and the applications of micropower with electrochemical microsystems.This book covers a wide spectrum of issues ranging from fundamental electrochemical processes to their applications in micro- and nanofabrication, microanalyses, microsensing, and their interaction with inorganic surfaces and biological systems. The editors provide comprehensive background to unique processes, such as the technological development of miniaturization, microfabrication, thin film deposition, etching, cleaning, planarization, and silicon processing technologies to introduce a wide range of applications in context.More than 40 internationally recognized industry, research, and medical experts provide insight on the current status and future trends in their fields. They also highlight the impact of applying electrochemical microsystem technologies on industries such as storage and packaging; microelectronics, sensors, and portable electronics; machining, polishing, anodization, and plating technologies in heavy industries; biosensing, biological implant technology, and neurobiology; and cross-disciplinary integrated systems.Electrochemical Microsystem Technologies is a valuable reference for graduate/postgraduate students, technologists, and researchers working in the field of electrochemical technology.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.