Tetsuya Osaka – författare

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Driven by the electronics industry, electrochemical technology has rapidly evolved, finding increasing applications in microelectronics, batteries, sensors, materials science, industrial fabrication, corrosion, microbiology, neurobiology and medicine. Electrochemical Microsystem Technologies provides an overview of the technological status; the development of micropatternings and micro-biosensors; and the applications of micropower with electrochemical microsystems.This book covers a wide spectrum of issues ranging from fundamental electrochemical processes to their applications in micro- and nanofabrication, microanalyses, microsensing, and their interaction with inorganic surfaces and biological systems. The editors provide comprehensive background to unique processes, such as the technological development of miniaturization, microfabrication, thin film deposition, etching, cleaning, planarization, and silicon processing technologies to introduce a wide range of applications in context.More than 40 internationally recognized industry, research, and medical experts provide insight on the current status and future trends in their fields. They also highlight the impact of applying electrochemical microsystem technologies on industries such as storage and packaging; microelectronics, sensors, and portable electronics; machining, polishing, anodization, and plating technologies in heavy industries; biosensing, biological implant technology, and neurobiology; and cross-disciplinary integrated systems.Electrochemical Microsystem Technologies is a valuable reference for graduate/postgraduate students, technologists, and researchers working in the field of electrochemical technology.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization.Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

In this book, the term "electrochemical nanotechnology" is defined as nanoprocessing by means of electrochemical techniques. This introductory book reviews the application of electrochemical nanotechnologies with the aim of understanding their wider applicability in evolving nanoindustries. These advances have impacted microelectronics, sensors, materials science, and corrosion science, generating new fields of research that promote interaction between biology, medicine, and microelectronics.This volume reviews nanotechnology applications in selected high technology areas with particular emphasis on advances in such areas. Chapters are classified under four different headings: Nanotechnology for energy devices - Nanotechnology for magnetic storage devices - Nanotechnology for bio-chip applications - Nanotechnology for MEMS/Packaging.

The unfortunate and serious accident at the nuclear power plants in Fukushima, Japan caused by the earthquake and tsunami in March 2011 dealt Japan a serious blow. Japan was nearly deprived of electric power when in response to the accident all nuclear reactors in Japan were shut down. This shortage further accelerated the introduction of renewable energies. This book surveys the new materials and approaches needed to use nanotechnology to introduce the next generation of advanced lithium batteries, currently the most promising energy storage devices available. It provides an overview of nanotechnology for lithium batteries from basic to applied research in selected high technology areas. The book especially focuses on near-term and future advances in these fields. All contributors to this book are expert researchers on lithium batteries.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

In this book, the term "electrochemical nanotechnology" is defined as nanoprocessing by means of electrochemical techniques. This introductory book reviews the application of electrochemical nanotechnologies with the aim of understanding their wider applicability in evolving nanoindustries. These advances have impacted microelectronics, sensors, materials science, and corrosion science, generating new fields of research that promote interaction between biology, medicine, and microelectronics.This volume reviews nanotechnology applications in selected high technology areas with particular emphasis on advances in such areas. Chapters are classified under four different headings: Nanotechnology for energy devices - Nanotechnology for magnetic storage devices - Nanotechnology for bio-chip applications - Nanotechnology for MEMS/Packaging.

The unfortunate and serious accident at the nuclear power plants in Fukushima, Japan caused by the earthquake and tsunami in March 2011 dealt Japan a serious blow. Japan was nearly deprived of electric power when in response to the accident all nuclear reactors in Japan were shut down. This shortage further accelerated the introduction of renewable energies. This book surveys the new materials and approaches needed to use nanotechnology to introduce the next generation of advanced lithium batteries, currently the most promising energy storage devices available. It provides an overview of nanotechnology for lithium batteries from basic to applied research in selected high technology areas. The book especially focuses on near-term and future advances in these fields. All contributors to this book are expert researchers on lithium batteries.