Jie Cheng – författare
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5 produkter
Global LAnd Surface Satellite (GLASS) Products
Algorithms, Validation and Analysis
Av Shunlin Liang, Xiaotong Zhang m. fl.
Häftad, 2013
552 kr
Lägg i varukorg
This book describes the algorithms, validation and preliminary analysis of the Global LAnd Surface Satellite (GLASS) products, a long-term, high-quality dataset that is now freely available worldwide to government organizations and agencies, scientific research institutions, students and members of …
Global LAnd Surface Satellite (GLASS) Products
Algorithms, Validation and Analysis
Av Xiang Zhao, Qiang Liu m. fl.
E-bok, 2013
734 kr
Lägg i varukorg
This book describes the algorithms, validation and preliminary analysis of the Global LAnd Surface Satellite (GLASS) products, a long-term, high-quality dataset that is now freely available worldwide to government organizations and agencies, scientific research institutions, students and members of …
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Av Jie Cheng
Inbunden, 2017
1096 kr
Lägg i varukorg
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the …
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Av Jie Cheng
E-bok, 2017
1459 kr
Lägg i varukorg
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the …
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Av Jie Cheng
Häftad, 2019
1096 kr
Lägg i varukorg
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the …