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Muhannad S. Bakir – författare

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3 produkter

  1. Muhannad S. Bakir, Erik Jan Marinissen, Paul D. Franzon - Handbook of 3D Integration, Volume 4, E-bok. Tillgänglighet: Lägg i varukorg

    Handbook of 3D Integration, Volume 4

    Design, Test, and Thermal Management

    Av Muhannad S. Bakir, Erik Jan Marinissen m. fl.

    E-bok, 2019

    2282 kr

    Lägg i varukorg

    This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part …

  2. Muhannad S. Bakir, Erik Jan Marinissen, Paul D. Franzon - Handbook of 3D Integration, Volume 4, E-bok. Tillgänglighet: Lägg i varukorg

    Handbook of 3D Integration, Volume 4

    Design, Test, and Thermal Management

    Av Muhannad S. Bakir, Erik Jan Marinissen m. fl.

    E-bok, 2019

    2282 kr

    Lägg i varukorg

    This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part …

  3. BAR-COHEN AVRAM, Pengli Zhu, Gang Li, C P Wong, Dae Young Jung, Stephen R Cain, William (Bill) T Chen, Bahgat G Sammakia, Muhannad S Bakir, Suresh K Sitaraman, Kuan-Neng Chen, Chuan Seng Tan - ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET), Inbunden. Tillgänglighet: Lägg i varukorg

    ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

    Av BAR-COHEN AVRAM, Pengli Zhu m. fl.

    Inbunden, 2019

    22007 kr

    Lägg i varukorg

    Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of …