Peter Ramm – författare
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9 produkter
Handbook of 3D Integration, Volume 1
Technology and Applications of 3D Integrated Circuits
Av Peter Ramm, Christopher Bower m. fl.
E-bok, 2011
3297 kr
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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature …
Handbook of Wafer Bonding
Av Maaike M. V. Taklo, James Jian-Qiang Lu m. fl.
E-bok, 2011
2526 kr
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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies …
Handbook of Wafer Bonding
Av Maaike M. V. Taklo, James Jian-Qiang Lu m. fl.
E-bok, 2011
2526 kr
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The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies …
Handbook of 3D Integration, Volume 3
3D Process Technology
Av Peter Ramm, Mitsumasa Koyanagi m. fl.
E-bok, 2014
2282 kr
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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and …
Handbook of 3D Integration, Volume 3
3D Process Technology
Av Peter Ramm, Mitsumasa Koyanagi m. fl.
E-bok, 2014
2282 kr
Lägg i varukorg
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and …
Die Merseburger Fotografenfamilie Herrfurth
Av Joachim Riebel, Joachim Riebel m. fl.
Inbunden, 2014
230 kr
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Dom und Schloss zu Merseburg
Av Peter Ramm
Häftad, 2008
137 kr
Tillfälligt slut
Merseburgs majestätische Stadtkrone aus Dom und Schloss über dem Fluss bietet eines der bemerkenswertesten Architekturbilder in Deutschland. Mit ihren Kunstschätzen repräsentiert sie über tausend Jahre Geschichte einer alten königlichen Pfalz-, bischöflichen Dom- und herzoglichen Residenzstadt. Der …
Handbook of 3D Integration, Volume 3
3D Process Technology
Av Philip Garrou, Philip Garrou m. fl.
Inbunden, 2014
1512 kr
Tillfälligt slut
Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and …
