Saurabh Sinha – författare
2 168 kr
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1 581 kr
Kommande
749 kr
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860 kr
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This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles:
Traditional and modern photolithography, the primary limiting factor of Moore’s law
Innovations in semiconductor manufacturing that makes current generation CMOS processing possible
Multi-disciplinary technologies that could drive Moore''s law forward significantly
Design principles for microelectronic circuits and components that take advantage of technology miniaturization
The semiconductor industry economic market trends and technical driving factors
The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
860 kr
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This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles:
Traditional and modern photolithography, the primary limiting factor of Moore’s law
Innovations in semiconductor manufacturing that makes current generation CMOS processing possible
Multi-disciplinary technologies that could drive Moore''s law forward significantly
Design principles for microelectronic circuits and components that take advantage of technology miniaturization
The semiconductor industry economic market trends and technical driving factors
The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Systems-Level Packaging for Millimeter-Wave Transceivers
1 090 kr
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1 379 kr
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This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Last Mile Internet Access for Emerging Economies
1 306 kr
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1 138 kr
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This book presents an investigative approach to globalization-driving technologies that efficiently deliver ubiquitous, last-mile, broadband internet access to emerging markets and rural areas. Research has shown that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, and has a positive effect on the lives of individuals. Last-mile internet access in developing countries is not only intended to provide areas with stable, efficient, and cost-effective broadband capabilities, but also to encourage the use of connectivity for human capacity development.
The book offers an overview of the principles of various technologies, such as light fidelity and millimeter-wave backhaul, as last-mile internet solutions and describes these potential solutions from a signal propagation perspective. It also provides readers with the notional context needed to understand their operation, benefits, and limitations, and enables them to investigate feasible and tailored solutions to ensure sustainable infrastructures that are expandable and maintainable.
Last Mile Internet Access for Emerging Economies
927 kr
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Millimeter-Wave Integrated Circuits
Methodologies for Research, Design and Innovation
1 417 kr
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1 672 kr
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This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, and describes how these have to be modified to fit the uniqueness of high-frequency nanoelectronics design. Each chapter focuses on a specific research challenge related to either small form factors or higher operating frequencies. The book first examines nanodevice scaling and the emerging electronic design automation tools that can be used in millimeter-wave research, as well as the singular challenges of combining deep-submicron and millimeter-wave design. It also demonstrates the importance of considering, in the millimeter-wave context, system-level design leading to differing packaging options. Further, it presents integrated circuit design methodologies for all major transceiver blocks typically employed at millimeter-wave frequencies, as these methodologies are normally fundamentally different from the traditionaldesign methodologies used in analogue and lower-frequency electronics. Lastly, the book discusses the methodologies of millimeter-wave research and design for extreme or harsh environments, rebooting electronics, the additional opportunities for terahertz research, and the main differences between the approaches taken in millimeter-wave research and terahertz research.
Millimeter-Wave Integrated Circuits
Methodologies for Research, Design and Innovation
1 417 kr
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Millimeter-wave Integrated Technologies in the Era of the Fourth Industrial Revolution
1 090 kr
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1 367 kr
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This peer-reviewed book explores the technologies driving broadband internet connectivity in the fourth industrial revolution (Industry 4.0). It particularly focuses on potential solutions to introduce these technologies in emerging markets and rural areas, regions that typically form part of the digital divide and often have under-developed telecommunications infrastructures, a lack of skilled workers, and geographical restrictions that limit broadband connectivity. Research shows that ubiquitous internet access boosts socio-economic growth through innovations in science and technology, with the common goal of bringing positive change to the lives of individuals. Fifth-generation (5G) networks based on millimeter-wave (mm-wave) frequency information transfer have the potential to provide future-proof, affordable and sustainable broadband connectivity in areas where previous-generation mobile networks were unable to do so. This book discusses the principles of various technologies that enable electronic circuits to operate at mm-wave frequencies. It examines the importance of identifying, describing, and analyzing technology from a purely technological standpoint, but also acknowledges and investigates the challenges and limitations of introducing such technologies in emerging markets. Presenting recent research, the book spearheads participation in Industry 4.0 in these areas.
Millimeter-wave Integrated Technologies in the Era of the Fourth Industrial Revolution
1 090 kr
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Mobile Communication Networks: 5G and a Vision of 6G
1 956 kr
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2 435 kr
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This book contributes to the body of scholarly knowledge by exploring the main ideas of wireless networks of past, present, and future, trends in the field of networking, the capabilities of 5G and technologies that are potential enablers of 6G, potential 6G applications and requirements, as well as unique challenges and opportunities that 6G research is going to offer over the next decade. It covers research topics such as communication via millimeter-waves, terahertz waves and visible light to enable faster speeds, as well as research into achieving other basic requirements of 6G networks. These include low end-to-end latency, high energy efficiency, coverage that is ubiquitous and always-on, integration of terrestrial wireless with non-terrestrial networks, network management that is made more effective by connected intelligence with machine learning capabilities, as well as support for the evolution of old service classes and support for new ones.
Mobile Communication Networks: 5G and a Vision of 6G
1 956 kr
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State-of-the-Art of Millimeter-Wave Silicon Technology
1 090 kr
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1 367 kr
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This book examines the critical differences between current and next-generation Si technologies (CMOS, BiCMOS and SiC) and technology platforms (e.g. system-on-chip) in mm-wave wireless applications. We provide a basic overview of the two technologies from a technical standpoint, followed by a review of the state-of-the-art of several key building blocks in wireless systems. The influences of system requirements on the choice of semiconductor technology are vital to understanding the merits of CMOS and BiCMOS devices – e.g., output power, battery life, adjacent channel interference, cost restrictions, and so forth. These requirements, in turn, affect component-level design and performance metrics of oscillators, mixers, power and low-noise amplifiers, as well as phase-locked loops and data converters. Finally, the book offers a peek into the next generation of wireless technologies such as THz -band systems and future 6G applications.
State-of-the-Art of Millimeter-Wave Silicon Technology
702 kr
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Microsensing Networks for Sustainable Cities
1 090 kr
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1 367 kr
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1 090 kr
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1 379 kr
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1 415 kr
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1 214 kr
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1 090 kr
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1 367 kr
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This book provides readers a thorough understanding of the applicability of new-generation silicon-germanium (SiGe) electronic subsystems for electronic warfare and defensive countermeasures in military contexts. It explains in detail the theoretical and technical background, and addresses all aspects of the integration of SiGe as an enabling technology for maritime, land, and airborne / spaceborne electronic warfare, including research, design, development, and implementation. The coverage is supported by mathematical derivations, informative illustrations, practical examples, and case studies. While SiGe technology provides speed, performance, and price advantages in many markets, to date only limited information has been available on its use in electronic warfare systems, especially in developing nations. Addressing that need, this book offers essential engineering guidelines that especially focus on the speed and reliability of current-generation SiGe circuits and highlight emerging innovations that help to ensure the sustainable long-term integration of SiGe into electronic warfare systems.