Shenglin Ma – författare

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2 produkter

1. 

   TSV 3D RF Integration

   High Resistivity Si Interposer Technology

   Av Shenglin Ma, Yufeng Jin

   Häftad, 2022

   2509 kr

   Lägg i varukorg

   TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed …

2. 

   TSV 3D RF Integration

   High Resistivity Si Interposer Technology

   Av Yufeng Jin, Shenglin Ma

   E-bok, 2022

   3498 kr

   Lägg i varukorg

   TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed …