Yufeng Jin – författare
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6 produkter
TSV 3D RF Integration
High Resistivity Si Interposer Technology
Häftad, 2022
2509 kr
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TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed …
TSV 3D RF Integration
High Resistivity Si Interposer Technology
E-bok, 2022
3498 kr
Lägg i varukorg
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed …
Introduction to Microsystem Packaging Technology
Av Yufeng Jin, Zhiping Wang m. fl.
Häftad, 2018
1028 kr
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The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in …
Introduction to Microsystem Packaging Technology
Av Jing Chen, Zhiping Wang m. fl.
E-bok, 2017
1212 kr
Lägg i varukorg
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use …
Introduction to Microsystem Packaging Technology
Av Yufeng Jin, Zhiping Wang m. fl.
Inbunden, 2010
3070 kr
Lägg i varukorg
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in …
Introduction to Microsystem Packaging Technology
Av Jing Chen, Zhiping Wang m. fl.
E-bok, 2017
1186 kr
Lägg i varukorg
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use …
