Suresh K. Sitaraman – författare
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4 produkter
Solder Joint Reliability Prediction for Multiple Environments
Av Andrew E. Perkins, Suresh K. Sitaraman
Inbunden, 2008
1096 kr
Lägg i varukorg
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple …
Solder Joint Reliability Prediction for Multiple Environments
Av Suresh K. Sitaraman, Andrew E. Perkins
E-bok, 2008
1459 kr
Lägg i varukorg
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple …
Solder Joint Reliability Prediction for Multiple Environments
Av Andrew E. Perkins, Suresh K. Sitaraman
Häftad, 2010
1228 kr
Lägg i varukorg
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple …
ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)
Av BAR-COHEN AVRAM, Pengli Zhu m. fl.
Inbunden, 2019
22007 kr
Lägg i varukorg
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of …
