Tor A. Fjeldly – författare

This book is a useful reference for practicing electrical engineers as well as a textbook for a junior/senior or graduate level course in electrical engineering. The authors combine two subjects: device modeling and circuit simulation - by providing a large number of well-prepared examples of circuit simulations immediately following the description of many device models.

Together with the internet site, this book is ideally suited for independent and remote studyWeb site is kept to date and guest educational institutions are invited to join in creating their own lab modules on different device aspectsFirst such programReputation of the authors who are leaders in the field of semiconductor electronics

Bridges the gap between device modelling and analog circuit design.Includes dedicated software enabling actual circuit design.Covers the three significant models: BSIM3, Model 9 &, and EKV.Presents practical guidance on device development and circuit implementation.The authors offer a combination of extensive academic and industrial experience.

In many respects, compound semiconductor technology has reached the age of maturity when applications will have been defined, yields are high enough and well established, and gallium arsenide and related compounds have carved many important niches in electronics. This book reviews the state-of-the-art of compound semiconductor electronics. It covers the microwave, millimeter wave, and submillimeter wave devices, monolithic microwave and digital integrated circuits made from compound semiconductors and emerging wide band semiconductor materials. The book is written by leading experts in compound semiconductor electronics from industry and academia and strikes the balance between practical applications, record-breaking results, and design and modeling tools specific for compound semiconductor technology. Engineers, scientists, and graduate students working in solid state electronics and especially in the area of compound semiconductor electronics will find this book very useful. It could also be used as a text or a supplementary text for graduate courses in this field.

The steady downscaling of device-feature size combined with a rapid increase in circuit complexity as well as the introduction of new device concepts based on non-silicon-material systems poses great challenges for device and circuit designers. One of the major tasks is the development of new and improved device models needed for accurate device and circuit design. Another task is the development of new circuit-simulation tools to handle very large and complex circuits. This book addresses both these issues with up-to-date reviews written by leading experts in the field.The first three chapters of the book discuss advanced device models both for existing technologies and for new, emerging technologies. Among the topics covered are models for MOSFETs, thin-film transitors (TFTs), and compound semiconductor devices, including GaAs HEMTs and HFETs, heterodimensional devices, quantum-tunneling devices, as well as wide-bandgap devices. Chapters 4 and 5 discuss advanced circuit simulators that hold promise for handling circuits of much higher complexity than what is possible for typical state-of-the-art circuit simulators today.

Surface acoustic wave (SAW) devices are recognized for their versatility and efficiency in controlling and processing electrical signals. This has resulted in a multitude of device concepts for a wide range of signal processing functions, such as delay lines, filters, resonators, pulse compressors, convolvers, and many more. As SAW technology has found its way into mass market products such as TV receivers, pagers, keyless entry systems and cellular phones, the production volume has risen to millions of devices produced every day. At the other end of the scale, there are specialized high performance signal processing SAW devices for satellite communication and military applications, such as radar and electronic warfare.This volume, together with Volume 2, presents an overview of recent advances in SAW technology, systems and applications by some of the foremost researchers in this exciting field.

Surface acoustic wave (SAW) devices are recognized for their versatility and efficiency in controlling and processing electrical signals. This has resulted in a multitude of device concepts for a wide range of signal processing functions, such as delay lines, filters, resonators, pulse compressors, convolvers, and many more. As SAW technology has found its way into mass market products such as TV receivers, pagers, keyless entry systems and cellular phones, the production volume has risen to millions of devices produced every day. At the other end of the scale, these are specialized high performance signal processing SAW devices for satellite communication and military applications, such as radar and electronic warfare.This volume, together with Volume 1, presents an overview of recent advances in SAW technology, systems and applications by some of the foremost researchers in this exciting field.

CMOS technology has now reached a state of evolution, in terms of both frequency and noise, where it is becoming a serious contender for radio frequency (RF) applications in the GHz range. Cutoff frequencies of about 50 GHz have been reported for 0.18 µm CMOS technology, and are expected to reach about 100 GHz when the feature size shrinks to 100 nm within a few years. This translates into CMOS circuit operating frequencies well into the GHz range, which covers the frequency range of many of today's popular wireless products, such as cell phones, GPS (Global Positioning System) and Bluetooth. Of course, the great interest in RF CMOS comes from the obvious advantages of CMOS technology in terms of production cost, high-level integration, and the ability to combine digital, analog and RF circuits on the same chip. This book discusses many of the challenges facing the CMOS RF circuit designer in terms of device modeling and characterization, which are crucial issues in circuit simulation and design.