YongAn Huang - Böcker

The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017. The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions.

The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions.

The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions.

This book provides an overview of essential research on and developments in the electrohydrodynamic (EHD) direct-writing technique and its applications. Firstly, it presents mechano- and helix electrospinning methods to achieve direct writing of straight/serpentine micro/nano fibers in high resolution. Secondly, it examines functional inks and multi nozzle arrays for EHD printing, which are used to efficientlyform patterns and devices. Thirdly, the book discusses the various control methods adopted in the context of EHD to improve the controllability of the electrospun fibers. Lastly, it addresses the equipment used in EHD printing and its applications, while also outlining challenges for the field’s future development. Combining academic and industrial viewpoints, the book provides in-depth information for experienced researchers, as well as a valuable guide for those just entering the field.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

This book provides an overview of essential research on and developments in the electrohydrodynamic (EHD) direct-writing technique and its applications.

Flexible electronics are electronics that can be stretched, bent, twisted, and deformed into arbitrary shapes. They break through the bottleneck and monopoly of traditional, rigid IC technologies and represent the next-generation electronics. This book provides an overview of the underlying theory and method of structural design for flexible electronics. Compared to intrinsically flexible and stretchable materials, structural engineering has proven its unique advantages, e.g. stretchable inorganic electronics. Based on the mechanical mechanisms, this book discusses the main structural deformation behaviors of flexible electronics, including mechanics of film-on-substrate and fiber-on-substrate, self-similar design with/without substrate, conformal design on rigid/soft substrate, purely in-plane design of serpentine interconnect with/without substrate, buckling-driven self-assembly and kirigami assembly strategies, neutral layer design, and the new materials-based structure design likeliquid metals, etc. Moreover, the related advanced fabrication technology, the devices designs and applications of flexible electronics are also presented. The comprehensive and in-depth content makes this book can be used as a reference book for experienced researchers, as well as a teaching material for graduate students.