YongAn Huang – författare

The three volume set LNAI 10462, LNAI 10463, and LNAI 10464 constitutes the refereed proceedings of the 10th International Conference on Intelligent Robotics and Applications, ICIRA 2017, held in Wuhan, China, in August 2017.

The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this first volume of the set are organized in topical sections on soft, micro-nano, bio-inspired robotics; human-machine interaction; swarm robotics; underwater robotics.

The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this second volume of the set are organized in topical sections on industrial robot and robot manufacturing; mechanism and parallel robotics; machine and robot vision; robot grasping and control.

The 235 papers presented in the three volumes were carefully reviewed and selected from 310 submissions. The papers in this third volume of the set are organized in topical sections on sensors and actuators; mobile robotics and path planning; virtual reality and artificial intelligence; aerial and space robotics; mechatronics and intelligent manufacturing.

This book provides an overview of essential research on and developments in the electrohydrodynamic (EHD) direct-writing technique and its applications. Firstly, it presents mechano- and helix electrospinning methods to achieve direct writing of straight/serpentine micro/nano fibers in high resolution. Secondly, it examines functional inks and multi nozzle arrays for EHD printing, which are used to efficientlyform patterns and devices. Thirdly, the book discusses the various control methods adopted in the context of EHD to improve the controllability of the electrospun fibers. Lastly, it addresses the equipment used in EHD printing and its applications, while also outlining challenges for the field’s future development.

Combining academic and industrial viewpoints, the book provides in-depth information for experienced researchers, as well as a valuable guide for those just entering the field.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.