Yueping Zhang – författare

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packagingAntenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP.  The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:• Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performanceWritten for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging

Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP.  The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:

• Includes a brief history of antenna-in-package technology  • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)  • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance

Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging

Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP.  The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book:

• Includes a brief history of antenna-in-package technology  • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)  • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance

Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

A comprehensive introduction to the theory and practice of differential antennasThe first antennas ever created were differential antennas, in the dipole and loop constructions, before the subsequent creation of the single-ended or monopole antenna. Dozens of basic antenna configurations have been invented since then, the majority of them differential. The theory and design of differential antennas therefore has an impact on a huge range of fields which make use of electromagnetic waves.Differential Antennas contains a thorough, comprehensive overview of these antennas, their theory, and their practical applications. It details the relationship between differential and single-ended antennas, which may act as tools for determining the properties of one when the other is known. This book offers an analysis of the role differential antennas play in wireless communication and sensing. Overall, it stands as an essential contribution to a key area of communications technology.Differential Antennas readers will also find: Chapters covering topics including microstrip antennas, shorted patch antennas, grid array antennas, and other designsTables and figures illustrating key data, antenna structures, and moreInstructions for measuring differential antennas for characterization and specification purposesDifferential Antennas is ideal for senior and graduate level students, researchers, and radio frequency engineers.

A comprehensive introduction to the theory and practice of differential antennas

The first antennas ever created were differential antennas, in the dipole and loop constructions, before the subsequent creation of the single-ended or monopole antenna. Dozens of basic antenna configurations have been invented since then, the majority of them differential. The theory and design of differential antennas therefore has an impact on a huge range of fields which make use of electromagnetic waves.

Differential Antennas contains a thorough, comprehensive overview of these antennas, their theory, and their practical applications. It details the relationship between differential and single-ended antennas, which may act as tools for determining the properties of one when the other is known. This book offers an analysis of the role differential antennas play in wireless communication and sensing. Overall, it stands as an essential contribution to a key area of communications technology.

Differential Antennas readers will also find:

Chapters covering topics including microstrip antennas, shorted patch antennas, grid array antennas, and other designs Tables and figures illustrating key data, antenna structures, and more Instructions for measuring differential antennas for characterization and specification purposes

Differential Antennas is ideal for senior and graduate level students, researchers, and radio frequency engineers.