Mike Ehlert and Kevin Ewsuk are the authors of CICMT 2005 - Ceramic Interconnect and Ceramic Microsystems Technologies CD-ROM: Proceedings and Exhibitor Presentations held April 10-13, 2005, Baltimore, Maryland, published by Wiley.

• KEYNOTE PRESENTATIONS.Present and Future Challenges in Multilayer Ceramic Devices (C.A. Randall, G. Yang, E. Dickey, R. Eitel, E. Semouchkina, G. Semouchkina, A. Baker, M.T. Lanagan, S. Rhee).Current and Future Directions for Ceramic Interconnect (C. Hoffmann, S. Brunner, M. Noren).Materials Process and Manufacturing: Current and Future Directions (A. Roosen). MATERIALS SOLUTION FOR MICROSYSTEMS.On-Board Fiber Alignment in LTCC Optoelectronic Packages (R. Eitel, A. Baker, J. Agraz, M. Lanagan, K. Uchino, C. Randall).Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System (H.T. Kim, K.W. Kang, J.-H. Nam, D.H. Yeo, K.J. Kim, J. Kim, T. Masaki).Micro Channel Fabrication in LTCC Substrate (W. Kinzy Jones, S. Kappagantula, J. Wang).Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications (J. Mueller, J. Pohlner, D. Schwanke, G. Reppe, H. Thust, R. Perrone). COFIRING PROCESSES.Cofiring of Mixed LTCC Dielectric Laminates (J.-H. Jean, J.-C. Chang, S.-C. Lin).Modeling to Understand, Predict, and Control LTCC Tape Shrinkage and Density During Firing (K. Ewsuk, M. Reiterer, J. Arguello, C. DiAntonio).Densification and Crystallization of DuPont 943 Tape During Firing (K. Ewsuk, M. Reiterer, T. Garino). MICROSYSTEM MATERIALS & INTEGRATION.Integration Concepts for the Fabrication of LTCC Structures (A. Baker, M. Lanagan, C. Randall, E. Semouchkina, G. Semouchkina, K.Z. Rajab, R. Mittra, R. Eitel, S. Rhee, P. Geggler, G. Fuhr).Development and Processing of an Anodic Bondable LTCC Tape (E. Müller, T. Bartnitzek, F. Bechtold, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, T. Schroter, S. Schundau, K. Kaschlik).Fabrication of LTCC Micro-Fludic Devices Using Sacrificial Carbon Layers (H. Birol, T. Maeder, C. Jacq, G. Corradini, R. Passerini, Y. Fourneir, S. Straessler, P. Ryser).LTCC Phase Shifter Modules for RF-MEMS-Switch Integration (T. Bartnitzek, E. Müller, R. van Dijk). DIMENSIONAL CONTROL IN LTCC SYSTEMSZero Shrinkage of LTCC by Self-Constrained Sintering (T. Rabe, W.A. Schiller, T. Hochheimer, C. Modes, A. Kipka).Self-Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application (A. Kipka, C. Modes, Q. Reynolds, M. Neidert, S. Malkmus, F. Gora).Via Fill for Zero X-Y Shrink LTCC Tapes (W. Zhang, D. Malanga, T. Hochheimer, P. Bokalo).Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications (M. Hagymasi, A. Roosen, R. Karmazin, S. Walter, A. Naeini, R. Matz). KEYNOTE PRESENTATION.Ceramic Microstructure for Automotive Applications (G. Schneider) CERAMIC MICROSYSTEMS AND APPLICATIONS I.Progress in MEMS and Micro Systems Research (C. Liu).Miniaturized Sensor Elements Based on LTCC Technology for Automotive and Airborne Applications (U. Schmid, H. Seidel, T. Becker).LTCC Sensors for Environmental Monitoring System (M.R. Gongora-Rubio, S.T. Kofuji, A.C. Seabra, E. Del Moral Hernandez, E.W. Simões, P.B. Verdonck, M.B.A. Fontes). PROCESSING INTEGRATED PASSIVES IN LTCC.Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943TM LTCC (D.S. Krueger, E. Parker, G. Barner, H. Morgenstern, F. Uribe, S. Reed).Magnetic Thin Film Technologies for Integrated Passives (K.-K. Choi, S. Sato, R. Chen, N. Mellen).Characterization of Dried Thick-Film Resistors (K. Krueger).Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components (D. Hague). CERAMIC MICROSYSTEMS AND APPLICATIONS II.Novel Microsystem Applications with New Techniques in LTCC (K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.W. Wroblewski, M. Okandan).Preparation of Polymeric Microspheres by an Emulsification/Solvent Diffusion Process Employing LTCC Microfluidic Structures (M.R. Gongora-Rubio, M.Rodrigues da Cunha, A. Penido de Oliveira Costa).Development of a Monopropellant Micro-Nozzle in Low Temperature Cofired Ceramic Tape (D.G. Plumee, J. Steciak, A.J. Moll). MATERIALS INTEGRATION IN LTCC.Low Sintering Ni-Cu-Zn-Ferrite Tapes for LTCC Integrated Inductors (S. Barth, F. Bechtold, E. Müller, J. Mürbe, J. Töpfer).Micron Scale Conductors and Integrated Passives in LTCC's (Electrophoretic Deposition by J.J. Van Tassel, C.A. Randall).Bulk Materials in LTCC Multilayers (M. Hintz, R. Perrone, H. Thust). KEYNOTE PRESENTATION.Integrated Design and Simulation Tools for Microsystems Packaging: Current Capabilities and Future Needs (M. Desmulliez). DESIGN AND FABRICATION OF CERAMIC MICROSYSTEMS AND DEVICES.Modular Micro Reaction System Including Ceramic Components (T. Moritz, R. Lenk, J. Adler, M. Zins).Ceramics in Microtechnology - Materials, Processing, Design (H.J. Ritzhaupt-Kleissl, J. Hauβelt, R. Ruprecht).Integrated Design and Simulation Tools for Microfluidic Systems (S. Krishnamoorthy, A.S. Bedekar, J.J. Feng, S. Sundaram).Fabrication of Microfluidic Oscillators by Laser Milling in Sintered LTCC and Quartz Substrates (R. Furlan, M. Perez Tolentino, I. Ramos, J.J. Santiago-Aviles). DESIGN, SIMULATION AND MODELING.Material Selection for Ceramic T/R Module Packages (R. Yamada, A. Piloto, E. Graddy, G. Aguirre, M. Eblen, A. Knudsen).Designing with LTCC in High Frequency Applications (T.P. Mobley, D.I. Amey).High-Performance Co-Planar Ferrite Inductors for RF Applications (M.D. Phillips, R.K. Settaluri).Novel Crosstalk Suppression Schemes Employing Magnetic Thin Films (A. Sligar, R.K. Settaluri, C.-H. Chang).CERAMIC MICROSYSTEMS AND DEVICES.LTCC Microfludic System (L.J. Golonka, T. Zawada, J. Radojewski, H. Roguszczak, M. Stefanow).Meso-Scale Remote Plasma Generator Using LTCC Technology (R.K. Yamamoto, P.B. Verdonck, M.R. Gongora-Rubio).Mini- and Micro-Channel Devices in LTCC (A.J. Moll, J. Youngsman, D.G. Plumlee, M. Schimpf).Processing of Ceramic Micro Parts via Low-Pressure Injection Molding (M. Müller, W. Bauer, H.J. Ritzhaupt-Kleissl). CHARACTERIZING MATERIALS INTEGRATION EFFECTS.Characterization of Dielectrics and Conductors for Ceramic Microsystems at Microwave Frequency (M. Lanagan, L. Haney, S. Perini, K. Rajab, E. Semouchkina).Materials Compatibility Issues in LTCC Technology and Their Effects on Structure and Electrical Properties (H. Birol, T. Maeder, P. Ryser).Sintering Behavior of a LTCC Material and Influence of Silver on the Sintering Behavior (D. Tramosljika, J. Schaefer, C. Rixecker, F. Aldinger).Interfacial Reaction Between Silver Electrode and La-Si-B-O-Mullite Glass Ceramics (Y.-J. Wang, W.-C.J. Wei).KEYNOTE PRESENTATION.Next-Generation Microsystems: Integration Technologies and Opportunities for Ceramics (D. Dimos).CERAMICS: THE MICROSYSTEM DEVICE ENABLER.LTCC Wet Chemical Analysis Meso-Systems (N. Ibáñez-Garcia, J.A. Chamarro, Z. Mendes Rocha, M.R. Gongora-Rubio).Development of Microfluidic Devices Using LTCC Substrates (R.E. Bruzetti Leminski, E.W. Simões, R. Furlan, M.R. Gongora-Rubio, Z. Mendes da Rocha, M. Rodrigues da Cunha, N.I. Morimoto, I. Ramos, J.J. Santiago-Aviles).Hot-Plate Gas Sensors - Are Ceramics Better? (J. Kita, F. Rettig, R. Moos, K.-H. Drüe, H. Thust).A Comparative Study of the Technology and Architecture for Actuators Realized with PZT Layers in LTCC Structures (D. Belavic, M. Santo Zarnik, M. Hrovat, J. Holc, M. Kosec, B. Malic, S. Drnovsek, J. Cilensek).INK JET PRINTING TECHNOLOGYInk Jet Printing of PZT (B. Derby, T. Wang).DoD-Printing of Conductive Silver Tracks (D. Cibis, K. Krueger ).MICROSYSTEM MATERIALS AND FABRICATION.Via Formation in LTCC Tape: A Comparison of Technologies (K.-J. Wolter, L. Rebenklau, G. Hagen).Direct-Write Laser Exposure of Photosensitive Conductive Inks Using Shaped-Beam Optics (S. Corbett, J. Strole, E. Swenson, W. Lu).High-Volume Print Forming, HVPFTM - A New Method for Manufacturing Large Volumes of Complex Metal-Ceramic and Hybrid Components (A.L. Chait).Cold Low Pressure Lamination of Ceramic Green Tapes (A. Roosen, K. Schindler).

Mike Ehlert and Kevin Ewsuk are the authors of CICMT 2005 - Ceramic Interconnect and Ceramic Microsystems Technologies CD-ROM: Proceedings and Exhibitor Presentations held April 10-13, 2005, Baltimore, Maryland, published by Wiley.

• KEYNOTE PRESENTATIONS.Present and Future Challenges in Multilayer Ceramic Devices (C.A. Randall, G. Yang, E. Dickey, R. Eitel, E. Semouchkina, G. Semouchkina, A. Baker, M.T. Lanagan, S. Rhee).Current and Future Directions for Ceramic Interconnect (C. Hoffmann, S. Brunner, M. Noren).Materials Process and Manufacturing: Current and Future Directions (A. Roosen). MATERIALS SOLUTION FOR MICROSYSTEMS.On-Board Fiber Alignment in LTCC Optoelectronic Packages (R. Eitel, A. Baker, J. Agraz, M. Lanagan, K. Uchino, C. Randall).Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System (H.T. Kim, K.W. Kang, J.-H. Nam, D.H. Yeo, K.J. Kim, J. Kim, T. Masaki).Micro Channel Fabrication in LTCC Substrate (W. Kinzy Jones, S. Kappagantula, J. Wang).Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications (J. Mueller, J. Pohlner, D. Schwanke, G. Reppe, H. Thust, R. Perrone). COFIRING PROCESSES.Cofiring of Mixed LTCC Dielectric Laminates (J.-H. Jean, J.-C. Chang, S.-C. Lin).Modeling to Understand, Predict, and Control LTCC Tape Shrinkage and Density During Firing (K. Ewsuk, M. Reiterer, J. Arguello, C. DiAntonio).Densification and Crystallization of DuPont 943 Tape During Firing (K. Ewsuk, M. Reiterer, T. Garino). MICROSYSTEM MATERIALS & INTEGRATION.Integration Concepts for the Fabrication of LTCC Structures (A. Baker, M. Lanagan, C. Randall, E. Semouchkina, G. Semouchkina, K.Z. Rajab, R. Mittra, R. Eitel, S. Rhee, P. Geggler, G. Fuhr).Development and Processing of an Anodic Bondable LTCC Tape (E. Müller, T. Bartnitzek, F. Bechtold, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, T. Schroter, S. Schundau, K. Kaschlik).Fabrication of LTCC Micro-Fludic Devices Using Sacrificial Carbon Layers (H. Birol, T. Maeder, C. Jacq, G. Corradini, R. Passerini, Y. Fourneir, S. Straessler, P. Ryser).LTCC Phase Shifter Modules for RF-MEMS-Switch Integration (T. Bartnitzek, E. Müller, R. van Dijk). DIMENSIONAL CONTROL IN LTCC SYSTEMSZero Shrinkage of LTCC by Self-Constrained Sintering (T. Rabe, W.A. Schiller, T. Hochheimer, C. Modes, A. Kipka).Self-Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application (A. Kipka, C. Modes, Q. Reynolds, M. Neidert, S. Malkmus, F. Gora).Via Fill for Zero X-Y Shrink LTCC Tapes (W. Zhang, D. Malanga, T. Hochheimer, P. Bokalo).Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications (M. Hagymasi, A. Roosen, R. Karmazin, S. Walter, A. Naeini, R. Matz). KEYNOTE PRESENTATION.Ceramic Microstructure for Automotive Applications (G. Schneider) CERAMIC MICROSYSTEMS AND APPLICATIONS I.Progress in MEMS and Micro Systems Research (C. Liu).Miniaturized Sensor Elements Based on LTCC Technology for Automotive and Airborne Applications (U. Schmid, H. Seidel, T. Becker).LTCC Sensors for Environmental Monitoring System (M.R. Gongora-Rubio, S.T. Kofuji, A.C. Seabra, E. Del Moral Hernandez, E.W. Simões, P.B. Verdonck, M.B.A. Fontes). PROCESSING INTEGRATED PASSIVES IN LTCC.Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943TM LTCC (D.S. Krueger, E. Parker, G. Barner, H. Morgenstern, F. Uribe, S. Reed).Magnetic Thin Film Technologies for Integrated Passives (K.-K. Choi, S. Sato, R. Chen, N. Mellen).Characterization of Dried Thick-Film Resistors (K. Krueger).Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components (D. Hague). CERAMIC MICROSYSTEMS AND APPLICATIONS II.Novel Microsystem Applications with New Techniques in LTCC (K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.W. Wroblewski, M. Okandan).Preparation of Polymeric Microspheres by an Emulsification/Solvent Diffusion Process Employing LTCC Microfluidic Structures (M.R. Gongora-Rubio, M.Rodrigues da Cunha, A. Penido de Oliveira Costa).Development of a Monopropellant Micro-Nozzle in Low Temperature Cofired Ceramic Tape (D.G. Plumee, J. Steciak, A.J. Moll). MATERIALS INTEGRATION IN LTCC.Low Sintering Ni-Cu-Zn-Ferrite Tapes for LTCC Integrated Inductors (S. Barth, F. Bechtold, E. Müller, J. Mürbe, J. Töpfer).Micron Scale Conductors and Integrated Passives in LTCC's (Electrophoretic Deposition by J.J. Van Tassel, C.A. Randall).Bulk Materials in LTCC Multilayers (M. Hintz, R. Perrone, H. Thust). KEYNOTE PRESENTATION.Integrated Design and Simulation Tools for Microsystems Packaging: Current Capabilities and Future Needs (M. Desmulliez). DESIGN AND FABRICATION OF CERAMIC MICROSYSTEMS AND DEVICES.Modular Micro Reaction System Including Ceramic Components (T. Moritz, R. Lenk, J. Adler, M. Zins).Ceramics in Microtechnology - Materials, Processing, Design (H.J. Ritzhaupt-Kleissl, J. Hauβelt, R. Ruprecht).Integrated Design and Simulation Tools for Microfluidic Systems (S. Krishnamoorthy, A.S. Bedekar, J.J. Feng, S. Sundaram).Fabrication of Microfluidic Oscillators by Laser Milling in Sintered LTCC and Quartz Substrates (R. Furlan, M. Perez Tolentino, I. Ramos, J.J. Santiago-Aviles). DESIGN, SIMULATION AND MODELING.Material Selection for Ceramic T/R Module Packages (R. Yamada, A. Piloto, E. Graddy, G. Aguirre, M. Eblen, A. Knudsen).Designing with LTCC in High Frequency Applications (T.P. Mobley, D.I. Amey).High-Performance Co-Planar Ferrite Inductors for RF Applications (M.D. Phillips, R.K. Settaluri).Novel Crosstalk Suppression Schemes Employing Magnetic Thin Films (A. Sligar, R.K. Settaluri, C.-H. Chang).CERAMIC MICROSYSTEMS AND DEVICES.LTCC Microfludic System (L.J. Golonka, T. Zawada, J. Radojewski, H. Roguszczak, M. Stefanow).Meso-Scale Remote Plasma Generator Using LTCC Technology (R.K. Yamamoto, P.B. Verdonck, M.R. Gongora-Rubio).Mini- and Micro-Channel Devices in LTCC (A.J. Moll, J. Youngsman, D.G. Plumlee, M. Schimpf).Processing of Ceramic Micro Parts via Low-Pressure Injection Molding (M. Müller, W. Bauer, H.J. Ritzhaupt-Kleissl). CHARACTERIZING MATERIALS INTEGRATION EFFECTS.Characterization of Dielectrics and Conductors for Ceramic Microsystems at Microwave Frequency (M. Lanagan, L. Haney, S. Perini, K. Rajab, E. Semouchkina).Materials Compatibility Issues in LTCC Technology and Their Effects on Structure and Electrical Properties (H. Birol, T. Maeder, P. Ryser).Sintering Behavior of a LTCC Material and Influence of Silver on the Sintering Behavior (D. Tramosljika, J. Schaefer, C. Rixecker, F. Aldinger).Interfacial Reaction Between Silver Electrode and La-Si-B-O-Mullite Glass Ceramics (Y.-J. Wang, W.-C.J. Wei).KEYNOTE PRESENTATION.Next-Generation Microsystems: Integration Technologies and Opportunities for Ceramics (D. Dimos).CERAMICS: THE MICROSYSTEM DEVICE ENABLER.LTCC Wet Chemical Analysis Meso-Systems (N. Ibáñez-Garcia, J.A. Chamarro, Z. Mendes Rocha, M.R. Gongora-Rubio).Development of Microfluidic Devices Using LTCC Substrates (R.E. Bruzetti Leminski, E.W. Simões, R. Furlan, M.R. Gongora-Rubio, Z. Mendes da Rocha, M. Rodrigues da Cunha, N.I. Morimoto, I. Ramos, J.J. Santiago-Aviles).Hot-Plate Gas Sensors - Are Ceramics Better? (J. Kita, F. Rettig, R. Moos, K.-H. Drüe, H. Thust).A Comparative Study of the Technology and Architecture for Actuators Realized with PZT Layers in LTCC Structures (D. Belavic, M. Santo Zarnik, M. Hrovat, J. Holc, M. Kosec, B. Malic, S. Drnovsek, J. Cilensek).INK JET PRINTING TECHNOLOGYInk Jet Printing of PZT (B. Derby, T. Wang).DoD-Printing of Conductive Silver Tracks (D. Cibis, K. Krueger ).MICROSYSTEM MATERIALS AND FABRICATION.Via Formation in LTCC Tape: A Comparison of Technologies (K.-J. Wolter, L. Rebenklau, G. Hagen).Direct-Write Laser Exposure of Photosensitive Conductive Inks Using Shaped-Beam Optics (S. Corbett, J. Strole, E. Swenson, W. Lu).High-Volume Print Forming, HVPFTM - A New Method for Manufacturing Large Volumes of Complex Metal-Ceramic and Hybrid Components (A.L. Chait).Cold Low Pressure Lamination of Ceramic Green Tapes (A. Roosen, K. Schindler).

Mike Ehlert and Kevin Ewsuk are the authors of CICMT 2005 - Ceramic Interconnect and Ceramic Microsystems Technologies CD-ROM: Proceedings and Exhibitor Presentations held April 10-13, 2005, Baltimore, Maryland, published by Wiley.

• KEYNOTE PRESENTATIONS.Present and Future Challenges in Multilayer Ceramic Devices (C.A. Randall, G. Yang, E. Dickey, R. Eitel, E. Semouchkina, G. Semouchkina, A. Baker, M.T. Lanagan, S. Rhee).Current and Future Directions for Ceramic Interconnect (C. Hoffmann, S. Brunner, M. Noren).Materials Process and Manufacturing: Current and Future Directions (A. Roosen). MATERIALS SOLUTION FOR MICROSYSTEMS.On-Board Fiber Alignment in LTCC Optoelectronic Packages (R. Eitel, A. Baker, J. Agraz, M. Lanagan, K. Uchino, C. Randall).Photosensitive Dielectric Paste for Micro-Patterning Technology in LTCC System (H.T. Kim, K.W. Kang, J.-H. Nam, D.H. Yeo, K.J. Kim, J. Kim, T. Masaki).Micro Channel Fabrication in LTCC Substrate (W. Kinzy Jones, S. Kappagantula, J. Wang).Development and Evaluation of Hermetic Ceramic Microwave Packages for Space Applications (J. Mueller, J. Pohlner, D. Schwanke, G. Reppe, H. Thust, R. Perrone). COFIRING PROCESSES.Cofiring of Mixed LTCC Dielectric Laminates (J.-H. Jean, J.-C. Chang, S.-C. Lin).Modeling to Understand, Predict, and Control LTCC Tape Shrinkage and Density During Firing (K. Ewsuk, M. Reiterer, J. Arguello, C. DiAntonio).Densification and Crystallization of DuPont 943 Tape During Firing (K. Ewsuk, M. Reiterer, T. Garino). MICROSYSTEM MATERIALS & INTEGRATION.Integration Concepts for the Fabrication of LTCC Structures (A. Baker, M. Lanagan, C. Randall, E. Semouchkina, G. Semouchkina, K.Z. Rajab, R. Mittra, R. Eitel, S. Rhee, P. Geggler, G. Fuhr).Development and Processing of an Anodic Bondable LTCC Tape (E. Müller, T. Bartnitzek, F. Bechtold, B. Pawlowski, P. Rothe, R. Ehrt, A. Heymel, E. Weiland, T. Schroter, S. Schundau, K. Kaschlik).Fabrication of LTCC Micro-Fludic Devices Using Sacrificial Carbon Layers (H. Birol, T. Maeder, C. Jacq, G. Corradini, R. Passerini, Y. Fourneir, S. Straessler, P. Ryser).LTCC Phase Shifter Modules for RF-MEMS-Switch Integration (T. Bartnitzek, E. Müller, R. van Dijk). DIMENSIONAL CONTROL IN LTCC SYSTEMSZero Shrinkage of LTCC by Self-Constrained Sintering (T. Rabe, W.A. Schiller, T. Hochheimer, C. Modes, A. Kipka).Self-Constrained Sintering LTCC - A Reliable Solution for Automotive Electronic Application (A. Kipka, C. Modes, Q. Reynolds, M. Neidert, S. Malkmus, F. Gora).Via Fill for Zero X-Y Shrink LTCC Tapes (W. Zhang, D. Malanga, T. Hochheimer, P. Bokalo).Novel Self-Constrained Sintered Composites of Dielectric and Ferrite LTCC Tapes for Microwave Applications (M. Hagymasi, A. Roosen, R. Karmazin, S. Walter, A. Naeini, R. Matz). KEYNOTE PRESENTATION.Ceramic Microstructure for Automotive Applications (G. Schneider) CERAMIC MICROSYSTEMS AND APPLICATIONS I.Progress in MEMS and Micro Systems Research (C. Liu).Miniaturized Sensor Elements Based on LTCC Technology for Automotive and Airborne Applications (U. Schmid, H. Seidel, T. Becker).LTCC Sensors for Environmental Monitoring System (M.R. Gongora-Rubio, S.T. Kofuji, A.C. Seabra, E. Del Moral Hernandez, E.W. Simões, P.B. Verdonck, M.B.A. Fontes). PROCESSING INTEGRATED PASSIVES IN LTCC.Post-Thermal Heat Treatment for Adjusting Buried Resistor Values in DuPont 943TM LTCC (D.S. Krueger, E. Parker, G. Barner, H. Morgenstern, F. Uribe, S. Reed).Magnetic Thin Film Technologies for Integrated Passives (K.-K. Choi, S. Sato, R. Chen, N. Mellen).Characterization of Dried Thick-Film Resistors (K. Krueger).Methods to Improve Yield and Efficiency in Laser Trim of Embedded Components (D. Hague). CERAMIC MICROSYSTEMS AND APPLICATIONS II.Novel Microsystem Applications with New Techniques in LTCC (K.A. Peterson, K.D. Patel, C.K. Ho, S.B. Rohde, C.D. Nordquist, C.A. Walker, B.W. Wroblewski, M. Okandan).Preparation of Polymeric Microspheres by an Emulsification/Solvent Diffusion Process Employing LTCC Microfluidic Structures (M.R. Gongora-Rubio, M.Rodrigues da Cunha, A. Penido de Oliveira Costa).Development of a Monopropellant Micro-Nozzle in Low Temperature Cofired Ceramic Tape (D.G. Plumee, J. Steciak, A.J. Moll). MATERIALS INTEGRATION IN LTCC.Low Sintering Ni-Cu-Zn-Ferrite Tapes for LTCC Integrated Inductors (S. Barth, F. Bechtold, E. Müller, J. Mürbe, J. Töpfer).Micron Scale Conductors and Integrated Passives in LTCC's (Electrophoretic Deposition by J.J. Van Tassel, C.A. Randall).Bulk Materials in LTCC Multilayers (M. Hintz, R. Perrone, H. Thust). KEYNOTE PRESENTATION.Integrated Design and Simulation Tools for Microsystems Packaging: Current Capabilities and Future Needs (M. Desmulliez). DESIGN AND FABRICATION OF CERAMIC MICROSYSTEMS AND DEVICES.Modular Micro Reaction System Including Ceramic Components (T. Moritz, R. Lenk, J. Adler, M. Zins).Ceramics in Microtechnology - Materials, Processing, Design (H.J. Ritzhaupt-Kleissl, J. Hauβelt, R. Ruprecht).Integrated Design and Simulation Tools for Microfluidic Systems (S. Krishnamoorthy, A.S. Bedekar, J.J. Feng, S. Sundaram).Fabrication of Microfluidic Oscillators by Laser Milling in Sintered LTCC and Quartz Substrates (R. Furlan, M. Perez Tolentino, I. Ramos, J.J. Santiago-Aviles). DESIGN, SIMULATION AND MODELING.Material Selection for Ceramic T/R Module Packages (R. Yamada, A. Piloto, E. Graddy, G. Aguirre, M. Eblen, A. Knudsen).Designing with LTCC in High Frequency Applications (T.P. Mobley, D.I. Amey).High-Performance Co-Planar Ferrite Inductors for RF Applications (M.D. Phillips, R.K. Settaluri).Novel Crosstalk Suppression Schemes Employing Magnetic Thin Films (A. Sligar, R.K. Settaluri, C.-H. Chang).CERAMIC MICROSYSTEMS AND DEVICES.LTCC Microfludic System (L.J. Golonka, T. Zawada, J. Radojewski, H. Roguszczak, M. Stefanow).Meso-Scale Remote Plasma Generator Using LTCC Technology (R.K. Yamamoto, P.B. Verdonck, M.R. Gongora-Rubio).Mini- and Micro-Channel Devices in LTCC (A.J. Moll, J. Youngsman, D.G. Plumlee, M. Schimpf).Processing of Ceramic Micro Parts via Low-Pressure Injection Molding (M. Müller, W. Bauer, H.J. Ritzhaupt-Kleissl). CHARACTERIZING MATERIALS INTEGRATION EFFECTS.Characterization of Dielectrics and Conductors for Ceramic Microsystems at Microwave Frequency (M. Lanagan, L. Haney, S. Perini, K. Rajab, E. Semouchkina).Materials Compatibility Issues in LTCC Technology and Their Effects on Structure and Electrical Properties (H. Birol, T. Maeder, P. Ryser).Sintering Behavior of a LTCC Material and Influence of Silver on the Sintering Behavior (D. Tramosljika, J. Schaefer, C. Rixecker, F. Aldinger).Interfacial Reaction Between Silver Electrode and La-Si-B-O-Mullite Glass Ceramics (Y.-J. Wang, W.-C.J. Wei).KEYNOTE PRESENTATION.Next-Generation Microsystems: Integration Technologies and Opportunities for Ceramics (D. Dimos).CERAMICS: THE MICROSYSTEM DEVICE ENABLER.LTCC Wet Chemical Analysis Meso-Systems (N. Ibáñez-Garcia, J.A. Chamarro, Z. Mendes Rocha, M.R. Gongora-Rubio).Development of Microfluidic Devices Using LTCC Substrates (R.E. Bruzetti Leminski, E.W. Simões, R. Furlan, M.R. Gongora-Rubio, Z. Mendes da Rocha, M. Rodrigues da Cunha, N.I. Morimoto, I. Ramos, J.J. Santiago-Aviles).Hot-Plate Gas Sensors - Are Ceramics Better? (J. Kita, F. Rettig, R. Moos, K.-H. Drüe, H. Thust).A Comparative Study of the Technology and Architecture for Actuators Realized with PZT Layers in LTCC Structures (D. Belavic, M. Santo Zarnik, M. Hrovat, J. Holc, M. Kosec, B. Malic, S. Drnovsek, J. Cilensek).INK JET PRINTING TECHNOLOGYInk Jet Printing of PZT (B. Derby, T. Wang).DoD-Printing of Conductive Silver Tracks (D. Cibis, K. Krueger ).MICROSYSTEM MATERIALS AND FABRICATION.Via Formation in LTCC Tape: A Comparison of Technologies (K.-J. Wolter, L. Rebenklau, G. Hagen).Direct-Write Laser Exposure of Photosensitive Conductive Inks Using Shaped-Beam Optics (S. Corbett, J. Strole, E. Swenson, W. Lu).High-Volume Print Forming, HVPFTM - A New Method for Manufacturing Large Volumes of Complex Metal-Ceramic and Hybrid Components (A.L. Chait).Cold Low Pressure Lamination of Ceramic Green Tapes (A. Roosen, K. Schindler).