'A wonderful collection of superbly documented industrial statistical experiences ... This book will inspire experienced researchers. Beginners, in addition, will learn a good deal about statistical techniques for industrial problem solving.' Lloyd S. Nelson, Journal of Quality Technology ' ... A good investment for those who are directly involved in the study or application of statistical methods.' George G. R. Maharage, Manufacturing Engineer

• ForewordPrefaceAcknowledgmentsIntroductionFacts About SEMATECHSEMATECH Qualification Plan, Veronica Czitrom and Karen HorrellPart One: GAUGE STUDIES. Chapter 1: Introduction to Gauge Studies, Veronica CzitromChapter 2: Prometrix RS35e Gauge Study in Five Two-Level Factors and One Three-Level Factor, James Buckner, Barry Chin, and Jon HenriChapter 3: Calibration of an FTIR Spectrometer for Measuring Carbon, Peter C. PankratzChapter 4: Revelation of a Microbalance Warm-Up Effect, James Buckner, Barry Chin, Todd Green, and Jon HenriChapter 5: GRR Methodology for Destructive Testing and Quantitative Assessment of Gauge Capability For One-Side Specifications, Teresa Mitchell, Victor Hegemann, and K. C. LiuPart Two: PASSIVE DATA COLLECTION. Chapter 6: Introduction to Passive Data Collection, Veronica CzitromChapter 7: Understanding the Nature of Variability in a Dry Etch Process, Richard O. Lynch and Richard J. MarkleChapter 8: Virgin Versus Recycled Wafers for Furnace Qualification: Is the Expense Justified?, Veronica Czitrom and Jack E. ReeceChapter 9: Identifying Sources of Variation in a Wafer Planarization Process, Arnon M. Hurwitz and Patrick D. SpagonChapter 10: Factors Which Affect the Number of Aerosol Particles Released by Clean Room Operators, William Kahn and Carole BaczkowskiChapter 11: A Skip-Lot Sampling Plan Based on Variance Components for Photolithographic Registration Measurements, Dwayne PepperChapter 12: Sampling to Meet a Variance Specification: Clean Room Qualification, Kathryn Hall and Steven CarpenterChapter 13: Snapshot: A Plot Showing Progress Through a Device Development Laboratory, Diane Lambert, James M. Landwehr, and Ming-Jen ShyuPart Three: DESIGN OF EXPERIMENTS. Chapter 14: Introduction To Design Of Experiments, Veronica CzitromChapter 15: Elimination of TiN Peeling During Exposure to CVD Tungsten Deposition Process Using Designed ExperimentsJames Buckner, David J. Cammenga, and Ann WeberChapter 16: Modeling a Uniformity Bulls-Eye Inversion, James Buckner, Richard Huang, Kenneth A. Monnig, Eliot K. Broadbent, Barry Chin, Jon Henri, Mark Sorell, and Kevin VenorChapter 17: Using Fewer Wafers to Resolve Confounding in Screening Experiments, Joel Barnett, Veronica Czitrom, Peter W. M. John, and Ramón V. LeónChapter 18: Planarization by Chemical Mechanical Polishing: A Rate and Uniformity Study, Anne E. Freeny and Warren Y.-C. LaiChapter 19: Use of Experimental Design to Optimize a Process for Etching Polycrystalline Silicon Gates, Fred Preuninger, Joseph Blasko, Steven Meester, and Taeho KookChapter 20: Optimization of a Wafer Stepper Alignment System Using Robust Design, Brenda Cantell, José Ramírez, and William GadsonPart Four: STATISTICAL PROCESS CONTROL. Chapter 21: Introduction to Statistical Process Control, Veronica CzitromChapter 22: Removing Drift Effects When Calculating Control Limits, Ray L. MarrChapter 23: Implementation of a Statistical Process Control Capability Strategy in the Manufacture of Raw Printed Circuit Boards for Surface Mount Technology, Ricky M. WatsonChapter 24: Obtaining and Using Statistical Process Control Limits in the Semiconductor Industry, Madhukar Joshi and Kimberley SpraguePart Five: EQUIPMENT RELIABILITY. Chapter 25: Introduction to Equipment Reliability, Veronica CzitromChapter 26: Marathon Report for a Photolithography Exposure Tool, John T. Canning and Kent G. GreenChapter 27: Experimentation for Equipment Reliability Improvement, Donald K. Lewis, Craig Hutchens, and Joseph M. SmithChapter 28: How to Determine Component-Based Preventive Maintenance Plans, Stephen V. CrowderPart Six: COMPREHENSIVE CASE STUDY. Chapter 29: Introduction to Comprehensive Case Study, Veronica CzitromChapter 30: Characterization of a Vertical Furnace Chemical Vapor Deposition (CVD) Silicon Nitride Process, Jack E. Reece and Mohsen ShenasaPart Seven: APPENDICES. Appendix: Introduction to Integrated Circuit Manufacture

'A wonderful collection of superbly documented industrial statistical experiences ... This book will inspire experienced researchers. Beginners, in addition, will learn a good deal about statistical techniques for industrial problem solving.' Lloyd S. Nelson, Journal of Quality Technology ' ... A good investment for those who are directly involved in the study or application of statistical methods.' George G. R. Maharage, Manufacturing Engineer

• ForewordPrefaceAcknowledgmentsIntroductionFacts About SEMATECHSEMATECH Qualification Plan, Veronica Czitrom and Karen HorrellPart One: GAUGE STUDIES. Chapter 1: Introduction to Gauge Studies, Veronica CzitromChapter 2: Prometrix RS35e Gauge Study in Five Two-Level Factors and One Three-Level Factor, James Buckner, Barry Chin, and Jon HenriChapter 3: Calibration of an FTIR Spectrometer for Measuring Carbon, Peter C. PankratzChapter 4: Revelation of a Microbalance Warm-Up Effect, James Buckner, Barry Chin, Todd Green, and Jon HenriChapter 5: GRR Methodology for Destructive Testing and Quantitative Assessment of Gauge Capability For One-Side Specifications, Teresa Mitchell, Victor Hegemann, and K. C. LiuPart Two: PASSIVE DATA COLLECTION. Chapter 6: Introduction to Passive Data Collection, Veronica CzitromChapter 7: Understanding the Nature of Variability in a Dry Etch Process, Richard O. Lynch and Richard J. MarkleChapter 8: Virgin Versus Recycled Wafers for Furnace Qualification: Is the Expense Justified?, Veronica Czitrom and Jack E. ReeceChapter 9: Identifying Sources of Variation in a Wafer Planarization Process, Arnon M. Hurwitz and Patrick D. SpagonChapter 10: Factors Which Affect the Number of Aerosol Particles Released by Clean Room Operators, William Kahn and Carole BaczkowskiChapter 11: A Skip-Lot Sampling Plan Based on Variance Components for Photolithographic Registration Measurements, Dwayne PepperChapter 12: Sampling to Meet a Variance Specification: Clean Room Qualification, Kathryn Hall and Steven CarpenterChapter 13: Snapshot: A Plot Showing Progress Through a Device Development Laboratory, Diane Lambert, James M. Landwehr, and Ming-Jen ShyuPart Three: DESIGN OF EXPERIMENTS. Chapter 14: Introduction To Design Of Experiments, Veronica CzitromChapter 15: Elimination of TiN Peeling During Exposure to CVD Tungsten Deposition Process Using Designed ExperimentsJames Buckner, David J. Cammenga, and Ann WeberChapter 16: Modeling a Uniformity Bulls-Eye Inversion, James Buckner, Richard Huang, Kenneth A. Monnig, Eliot K. Broadbent, Barry Chin, Jon Henri, Mark Sorell, and Kevin VenorChapter 17: Using Fewer Wafers to Resolve Confounding in Screening Experiments, Joel Barnett, Veronica Czitrom, Peter W. M. John, and Ramón V. LeónChapter 18: Planarization by Chemical Mechanical Polishing: A Rate and Uniformity Study, Anne E. Freeny and Warren Y.-C. LaiChapter 19: Use of Experimental Design to Optimize a Process for Etching Polycrystalline Silicon Gates, Fred Preuninger, Joseph Blasko, Steven Meester, and Taeho KookChapter 20: Optimization of a Wafer Stepper Alignment System Using Robust Design, Brenda Cantell, José Ramírez, and William GadsonPart Four: STATISTICAL PROCESS CONTROL. Chapter 21: Introduction to Statistical Process Control, Veronica CzitromChapter 22: Removing Drift Effects When Calculating Control Limits, Ray L. MarrChapter 23: Implementation of a Statistical Process Control Capability Strategy in the Manufacture of Raw Printed Circuit Boards for Surface Mount Technology, Ricky M. WatsonChapter 24: Obtaining and Using Statistical Process Control Limits in the Semiconductor Industry, Madhukar Joshi and Kimberley SpraguePart Five: EQUIPMENT RELIABILITY. Chapter 25: Introduction to Equipment Reliability, Veronica CzitromChapter 26: Marathon Report for a Photolithography Exposure Tool, John T. Canning and Kent G. GreenChapter 27: Experimentation for Equipment Reliability Improvement, Donald K. Lewis, Craig Hutchens, and Joseph M. SmithChapter 28: How to Determine Component-Based Preventive Maintenance Plans, Stephen V. CrowderPart Six: COMPREHENSIVE CASE STUDY. Chapter 29: Introduction to Comprehensive Case Study, Veronica CzitromChapter 30: Characterization of a Vertical Furnace Chemical Vapor Deposition (CVD) Silicon Nitride Process, Jack E. Reece and Mohsen ShenasaPart Seven: APPENDICES. Appendix: Introduction to Integrated Circuit Manufacture

'A wonderful collection of superbly documented industrial statistical experiences ... This book will inspire experienced researchers. Beginners, in addition, will learn a good deal about statistical techniques for industrial problem solving.' Lloyd S. Nelson, Journal of Quality Technology ' ... A good investment for those who are directly involved in the study or application of statistical methods.' George G. R. Maharage, Manufacturing Engineer

• ForewordPrefaceAcknowledgmentsIntroductionFacts About SEMATECHSEMATECH Qualification Plan, Veronica Czitrom and Karen HorrellPart One: GAUGE STUDIES. Chapter 1: Introduction to Gauge Studies, Veronica CzitromChapter 2: Prometrix RS35e Gauge Study in Five Two-Level Factors and One Three-Level Factor, James Buckner, Barry Chin, and Jon HenriChapter 3: Calibration of an FTIR Spectrometer for Measuring Carbon, Peter C. PankratzChapter 4: Revelation of a Microbalance Warm-Up Effect, James Buckner, Barry Chin, Todd Green, and Jon HenriChapter 5: GRR Methodology for Destructive Testing and Quantitative Assessment of Gauge Capability For One-Side Specifications, Teresa Mitchell, Victor Hegemann, and K. C. LiuPart Two: PASSIVE DATA COLLECTION. Chapter 6: Introduction to Passive Data Collection, Veronica CzitromChapter 7: Understanding the Nature of Variability in a Dry Etch Process, Richard O. Lynch and Richard J. MarkleChapter 8: Virgin Versus Recycled Wafers for Furnace Qualification: Is the Expense Justified?, Veronica Czitrom and Jack E. ReeceChapter 9: Identifying Sources of Variation in a Wafer Planarization Process, Arnon M. Hurwitz and Patrick D. SpagonChapter 10: Factors Which Affect the Number of Aerosol Particles Released by Clean Room Operators, William Kahn and Carole BaczkowskiChapter 11: A Skip-Lot Sampling Plan Based on Variance Components for Photolithographic Registration Measurements, Dwayne PepperChapter 12: Sampling to Meet a Variance Specification: Clean Room Qualification, Kathryn Hall and Steven CarpenterChapter 13: Snapshot: A Plot Showing Progress Through a Device Development Laboratory, Diane Lambert, James M. Landwehr, and Ming-Jen ShyuPart Three: DESIGN OF EXPERIMENTS. Chapter 14: Introduction To Design Of Experiments, Veronica CzitromChapter 15: Elimination of TiN Peeling During Exposure to CVD Tungsten Deposition Process Using Designed ExperimentsJames Buckner, David J. Cammenga, and Ann WeberChapter 16: Modeling a Uniformity Bulls-Eye Inversion, James Buckner, Richard Huang, Kenneth A. Monnig, Eliot K. Broadbent, Barry Chin, Jon Henri, Mark Sorell, and Kevin VenorChapter 17: Using Fewer Wafers to Resolve Confounding in Screening Experiments, Joel Barnett, Veronica Czitrom, Peter W. M. John, and Ramón V. LeónChapter 18: Planarization by Chemical Mechanical Polishing: A Rate and Uniformity Study, Anne E. Freeny and Warren Y.-C. LaiChapter 19: Use of Experimental Design to Optimize a Process for Etching Polycrystalline Silicon Gates, Fred Preuninger, Joseph Blasko, Steven Meester, and Taeho KookChapter 20: Optimization of a Wafer Stepper Alignment System Using Robust Design, Brenda Cantell, José Ramírez, and William GadsonPart Four: STATISTICAL PROCESS CONTROL. Chapter 21: Introduction to Statistical Process Control, Veronica CzitromChapter 22: Removing Drift Effects When Calculating Control Limits, Ray L. MarrChapter 23: Implementation of a Statistical Process Control Capability Strategy in the Manufacture of Raw Printed Circuit Boards for Surface Mount Technology, Ricky M. WatsonChapter 24: Obtaining and Using Statistical Process Control Limits in the Semiconductor Industry, Madhukar Joshi and Kimberley SpraguePart Five: EQUIPMENT RELIABILITY. Chapter 25: Introduction to Equipment Reliability, Veronica CzitromChapter 26: Marathon Report for a Photolithography Exposure Tool, John T. Canning and Kent G. GreenChapter 27: Experimentation for Equipment Reliability Improvement, Donald K. Lewis, Craig Hutchens, and Joseph M. SmithChapter 28: How to Determine Component-Based Preventive Maintenance Plans, Stephen V. CrowderPart Six: COMPREHENSIVE CASE STUDY. Chapter 29: Introduction to Comprehensive Case Study, Veronica CzitromChapter 30: Characterization of a Vertical Furnace Chemical Vapor Deposition (CVD) Silicon Nitride Process, Jack E. Reece and Mohsen ShenasaPart Seven: APPENDICES. Appendix: Introduction to Integrated Circuit Manufacture