Reliability Prediction for Microelectronics

JOSEPH B. BERNSTEIN, PHD, is Director of the Laboratory for Failure Analysis and Reliability of Electronic Systems at Ariel University, Israel. He has worked and published extensively on failure analysis and defect avoidance in microelectronics, and is a senior member of IEEE.ALAIN A. BENSOUSSAN, PHD, is a Consulting Reliability Engineer with decades of experience as an Expert on Optics and Opto-Electronics Parts at Thales Alenia Space. He has conducted research in many areas of microelectronics reliability and physics of failure.EMMANUEL BENDER, PHD, completed his PhD in Electrical and Electronics Engineering, specializing in Microelectronics Reliability, at Ariel University, Israel, in 2022.

• Author Biography xiiiSeries Foreword xvPreface xixScope xxiIntroduction xxiii1 Conventional Electronic System Reliability Prediction 11.1 Electronic Reliability Prediction Methods 21.2 Electronic Reliability in Manufacturing, Production, and Operations 271.3 Reliability Criteria 341.4 Reliability Testing 422 The Fundamentals of Failure 552.1 The Random Walk 562.2 Diffusion 612.3 Solutions for the Diffusion Equation 632.4 Drift 692.5 Statistical Mechanics 702.6 Chemical Potential 742.7 Thermal Activation Energy 772.8 Oxidation and Corrosion 812.9 Vibration 852.10 Summary 893 Physics-of-Failure-based Circuit Reliability 913.1 Problematic Areas 923.2 Reliability of Complex Systems 1133.3 Physics-of-Failure-based Circuit Reliability Prediction Methodology 1194 Transition State Theory 1334.1 Stress-Related Failure Mechanisms 1344.2 Non-Arrhenius Model Parameters 1384.3 Physics of Healthy 1715 Multiple Failure Mechanism in Reliability Prediction 1795.1 MTOL Testing System 1835.2 MTOL Matrix: A Use Case Application 1915.3 Comparison of DSM Technologies (45, 28, and 20 nm) 2005.4 16 nm FinFET Reliability Profile Using the MTOL Method 2045.5 16 nm Microchip Health Monitoring (MHM) from MTOL Reliability 2156 System Reliability 2296.1 Definitions 2306.2 Series Systems 2326.3 Weibull Analysis of Data 2416.4 Weibull Analysis to Correlate Process Variations and BTI Degradation 2477 Device Failure Mechanism 2557.1 Time-Dependent Dielectric Breakdown 2577.2 Hot Carrier Injection 2657.3 Negative Bias Temperature Instability 2767.4 Electromigration 2827.5 Soft Errors due to Memory Alpha Particles 2858 Reliability Modeling of Electronic Packages 2898.1 Failure Mechanisms of Electronic Packages 2938.2 Failure Mechanisms’ Description and Models 2978.3 Failure Models 3108.4 Electromigration 3158.5 Corrosion Failure 3178.6.1 Creep 3228.7 Reliability Prediction of Electronic Packages 3258.8 Reliability Failure Models 325References 331Index 363