Banqiu Wu – författare

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Photomasks are defect-free optical templates -- the printing masters for the fabrication of integrated circuits (ICs). When IC feature sizes fall below the exposure tool’s source wavelength, photomask fabrication becomes difficult: very strict mask critical dimension (CD) and feature placement specifications, intensive capital equipment investment, unique raw materials and applications, and special expertise requirements for photomask fabrication technologists are necessary to fabricate modern microelectronics. Thus the rapid recent growth of the field and the need for this book.This text details the science and technology of industrial photomask production, including fundamental principles, industrial production flows, technological evolution and development, and state of the art technologies. Focusing on industrial applications rather than pure science, the goal of the book is to provide a comprehensive reference for any engineer developing microelectronic manufacturing processes

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology