C. P. Wong – författare

Visar alla böcker från författaren C. P. Wong. Handla med fri frakt och snabb leverans.

3 produkter

Kategorier

3 produkter

Electronics Manufacturing
with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
AvRicky S. W. Lee,Ning-Cheng Leem. fl.
E-bok
PDF, Engelska, 2002
1 749 kr
Läs direkt efter köp
ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS
This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field.
Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored:
* Chip (wafer) level interconnects with lead-free solder bumps* Lead-free solder wafer bumping with micro-ball mounting and paste printing methods* Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates* Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs* Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate* Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages* Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging* Environmental issues for conventional PCBs and substrates* Some environmentally conscious flame-retardants for PCBs and organic substrates* Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety* Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives* Criteria, development approaches, and varieties of alloys and properties of lead-free solders* Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders* Manufacturing process and performance of lead-free surface finishes for both PCB and component applications* Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process* Fundamental understanding of electrically conductive adhesive (ECA) technology* Effects of lubricant removal and cure shrinkage on ECAs* Mechanisms underlying the contact resistance shifts of ECAs* Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs* Stabilization of contact resistance of ECAs using various additives
Polymers for Electronic & Photonic Application
AvC. P. Wong
E-bok
PDF, Engelska, 2013
1 023 kr
Läs direkt efter köp
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field.* Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)
AvBAR-COHEN AVRAM,Pengli Zhum. fl.
Inbunden, Engelska, 2019
22 007 kr
Skickas inom 5-8 vardagar
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging "learning curve," the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Företag, bibliotek eller offentlig verksamhet?

C. P. Wong – författare

Electronics Manufacturing

Polymers for Electronic & Photonic Application

ENCYCLOPEDIA OF PACKAGING MATERIALS, PROCESSES, AND MECHANICS - SET 1: DIE-ATTACH AND WAFER BONDING TECHNOLOGY (A 4-VOLUME SET)

Mina sidor

Mina sidor

Hjälp

Hjälp

Om Bokus

Om Bokus

Populärt

Populärt

Inspiration

Inspiration