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Ronald J. Gutmann – författare

Visar alla böcker från författaren Ronald J. Gutmann. Handla med fri frakt och snabb leverans.

7 produkter

  1. Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif - Wafer Level 3-D ICs Process Technology, Inbunden. Tillgänglighet: Lägg i varukorg

    Wafer Level 3-D ICs Process Technology

    Av Chuan Seng Tan, Ronald J. Gutmann m. fl.

    Inbunden, 2008

    1641 kr

    Lägg i varukorg

    Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of …

  2. L. Rafael Reif, Ronald J. Gutmann, Chuan Seng Tan - Wafer Level 3-D ICs Process Technology, E-bok. Tillgänglighet: Lägg i varukorg

    Wafer Level 3-D ICs Process Technology

    Av L. Rafael Reif, Ronald J. Gutmann m. fl.

    E-bok, 2009

    2111 kr

    Lägg i varukorg

    Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of …

  3. Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann - Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses, Inbunden. Tillgänglighet: Lägg i varukorg

    Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

    Fundamental Mechanisms and Application to IC Interconnect Technology

    Av Christopher Lyle Borst, William N. Gill m. fl.

    Inbunden, 2002

    1641 kr

    Lägg i varukorg

    As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main …

  4. Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif - Wafer Level 3-D ICs Process Technology, Häftad. Tillgänglighet: Lägg i varukorg

    Wafer Level 3-D ICs Process Technology

    Av Chuan Seng Tan, Ronald J. Gutmann m. fl.

    Häftad, 2010

    1641 kr

    Lägg i varukorg

    Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of …

  5. Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann - Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses, Häftad. Tillgänglighet: Lägg i varukorg

    Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

    Fundamental Mechanisms and Application to IC Interconnect Technology

    Av Christopher Lyle Borst, William N. Gill m. fl.

    Häftad, 2014

    1641 kr

    Lägg i varukorg

    As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main …

  6. Ronald J. Gutmann, William N. Gill, Christopher Lyle Borst - Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses, E-bok. Tillgänglighet: Lägg i varukorg

    Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

    Fundamental Mechanisms and Application to IC Interconnect Technology

    Av Ronald J. Gutmann, William N. Gill m. fl.

    E-bok, 2013

    2111 kr

    Lägg i varukorg

    As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main …

  7. Ronald J. Gutmann, Shyam P. Murarka, Joseph M. Steigerwald - Chemical Mechanical Planarization of Microelectronic Materials, E-bok. Tillgänglighet: Lägg i varukorg

    Chemical Mechanical Planarization of Microelectronic Materials

    Av Ronald J. Gutmann, Shyam P. Murarka m. fl.

    E-bok, 2008

    2379 kr

    Lägg i varukorg

    Chemical Mechanical Planarization (CMP) plays an important role in today''s microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal …