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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Thoroughly revised, comprehensive coverage of battery technology, characteristics, and applicationsThis fully updated guide offers complete coverage of batteries and battery usage―from classic designs to emerging technologies. Compiled by a pioneer in secondary lithium batteries, the book contains all the information needed to solve engineering problems and make proper battery selections. You will get in-depth descriptions of the principles, properties, and performance specifications of every major battery type. Linden’s Handbook of Batteries, Fifth Edition, contains cutting-edge data and equations, design specifications, and troubleshooting techniques from international experts. New chapters discuss renewable energy systems, battery failure analysis, lithium-ion battery technology, materials, and component design. Recent advances in smartphones and hybrid car batteries are clearly explained, including maximizing re-chargeability, reducing cost, improving safety, and lessening environmental impact.Coverage includes:• Electricity, electrochemistry, and batteries• Raw materials• Battery components• Principles of electrochemical cell operations• Battery product overview• Electrochemical cell designs (platform technologies)• Primary batteries• Secondary batteries• Miscellaneous and specialty batteries• Battery applications• Battery industry infrastructure

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

Proven processes for ensuring semiconductor device reliability

Co-written by experts in the field, Semiconductor Process Reliability in Practice contains detailed descriptions and analyses of reliability and qualification for semiconductor device manufacturing and discusses the underlying physics and theory. The book covers initial specification definition, test structure design, analysis of test structure data, and final qualification of the process. Real-world examples of test structure designs to qualify front-end-of-line devices and back-end-of-line interconnects are provided in this practical, comprehensive guide.

Coverage includes:

Basic device physicsProcess flow for MOS manufacturingMeasurements useful for device reliability characterizationHot carrier injectionGate-oxide integrity (GOI) and time-dependentdielectric breakdown (TDDB)Negative bias temperature instabilityPlasma-induced damageElectrostatic discharge protection of integrated circuitsElectromigrationStress migrationIntermetal dielectric breakdown

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

In-depth coverage of integrated circuit design on the nanoscale level

Written by international experts in industry and academia, CMOS Nanoelectronics addresses the state of the art in integrated circuit design in the context of emerging systems. New, exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. This cutting-edge guide explores emerging design concepts for very low power and describes design approaches for RF transceivers, high-speed serial links, PLL/DLL, and ADC/DAC converters.

CMOS Nanoelectronics covers:

Portable high-efficiency polar transmittersAll-digital RF signal generationFrequency multiplier designTunable CMOS RF filtersGaAs HBT linear power amplifier designHigh-speed serial I/O designCDMA-based crosstalk cancellationDelta-sigma fractional-N PLLDelay locked loopsDigital clock generatorsAnalog design in deep submicron CMOS technologies1/f noise reduction for linear analog CMOS ICsBroadband high-resolution bandpass sigma-delta modulatorsAnalog/digital conversion specifications for power line communication systemsDigital-to-analog converters for LCDsSub-1-V CMOS bandgap reference designAnd much more

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

THE DEFINITIVE GUIDE TO POWER QUALITY--UPDATED AND EXPANDED

Electrical Power Systems Quality, Third Edition, is a complete, accessible, and up-to-date guide to identifying and preventing the causes of power quality problems. The information is presented without heavy-duty equations, making it practical and easily readable for utility engineers, industrial engineers, technicians, and equipment designers. This in-depth resource addresses the essentials of power quality and tested methods to improve compatibility among the power system, customer equipment, and processes.

Coverage includes:

Standard terms and definitions for power quality phenomenaProtecting against voltage sags and interruptionsHarmonic phenomena and dealing with harmonic distortionTransient overvoltagesLong-duration voltage variationsBenchmarking power qualityInternational Electrotechnical Commission (IEC) and Institute of Electrical and Electronics Engineers (IEEE) standardsMaintaining power quality in distributed generation systemsCommon wiring and grounding problems, along with solutionsSite surveys and power quality monitoring

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

The latest techniques for designing state-of-the-artpower supplies, including resonant (LLC) converters

Extensively revised throughout, Switching Power Supply Design & Optimization, Second Edition, explains how to design reliable, high-performance switching power supplies for today's cutting-edge electronics. The book covers modern topologies and converters and features newinformation on designing or selecting bandgap references, transformer design using detailed new design charts for proximity effects, Buck efficiency loss teardown diagrams, active reset techniques, topology morphology, and a meticulous AC-DC front-end design procedure.

This updated resource contains design charts and numerical examples for comprehensive feedback loop design, including TL431, plus the world’s first top-down simplified design methodology for wide-input resonant (LLC) converters. A step-by-step comparative designprocedure for Forward and Flyback converters is also included in this practical guide.

The new edition covers:

Voltage referencesDC-DC converters: topologies to configurationsContemporary converters, composites, and related techniquesDiscontinuous conduction modeComprehensive front-end design in AC-DC power conversionTopologies for AC-DC applicationsTapped-inductor (autotransformer-based) convertersSelecting inductors for DC-DC convertersFlyback and Forward converter transformer designForward and Flyback converters: step-by-step design and comparisonPCBs and thermal managementClosing the loop: feedback and stability, including TL431Practical EMI filter designReset techniques in Flyback and Forward convertersReliability, testing, and safety issuesUnraveling and optimizing Buck converter efficiencyIntroduction to soft-switching and detailed LLC converter design methodology with PSpice simulationsPractical circuits, design ideas, and component FAQs

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

A Complete Guide to Transmitting Electrical Power and Data over Ethernet Cables

Power over Ethernet Interoperability explains how to safely transmit DC power over an existing data network cabling structure so that separate AC electrical wiring is not needed to power up devices connected to the network. With a focus on cost-effective unshielded twisted pair (UTP) cables, this book provides proven methods for designing reliable Power over Ethernet (PoE) equipment and ensuring that it functions effectively. Details on the IEEE 802.3af/at standards and how various devices can operate from PoE are also contained in this practical resource.

Coverage includes:

The evolution of PoEOverview of PoE implementationsDetectionClassificationInrush and power-upOperationMaintain power and disconnectPoE state-machine diagramsMagneticsIsolation, PCB design, and safetySurge testing and protectionLab skills, thermal management, and decouplingN-pair power delivery systemsAuxiliary power and flyback design

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

Cutting-edge techniques for ultra-wideband, low-noise amplifier design

This pioneering resource presents alternatives for implementing power- and area-efficient integrated low-noise amplifiers for ultra-wideband communications. Design methodologies for distributed amplifiers, feedback amplifiers, inductor structures with reduced area, and inductorless techniques are discussed. Cowritten by international experts in industry and academia, this book addresses the state of the art in integrated circuitdesign in the context of emerging systems.

Design of Low-Noise Amplifiers for Ultra-WidebandCommunications covers:

Ultra-wideband overview and system approachDistributed amplifiersWideband low-noise amplifiersFeedback wideband low-noise amplifiersInductorless techniques

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  authenticity, or access to any online entitlements included with the product.

Cutting-edge nanoelectronic mixed-signal system design methods

Winner of the Association of American Publishers' 2016 PROSE Award in the Textbook/Physical Sciences & Mathematics category.

Written by the director of the NanoSystem Design Laboratory at the University of North Texas, this authoritative resource discusses mixed-signal circuit and system design based on existing and emerging nanoelectronic technologies. The book features coverage of both digital and analog applications using nanoscale CMOS and post-CMOS. Key techniques required for design for excellence and manufacturability are discussed in this practice-driven text.

Nanoelectronic Mixed-Signal System Design covers:

Opportunities and challenges of nanoscale technology and systemsEmerging systems designed as analog/mixed-signal system-on-chips (AMS-SoCs)Nanoelectronics issues in design for excellencePhase-locked loop component circuitsElectronic signal converter circuitsSensor circuits and systemsMemory in the AMS-SoCsMixed-signal circuit and system design flowMixed-signal circuit and system simulationPower-, parasitic-, and thermal-aware AMS-SoC design methodologiesVariability-aware AMS-SoC design methodologiesMetamodel-based fast AMS-SoC design methodologies

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

THE LATEST ANALOG IC DESIGN TECHNIQUES

Fully revised and expanded to meet the emerging demands of mixedsignal systems, Analog IC Design with Low-Dropout Regulators, Second Edition, teaches analog IC concepts and explains how to use them to design, analyze,and build linear low-dropout (LDO) regulator ICs with bipolar, CMOS, and biCMOS semiconductor process technologies. The book draws physical insight from topics presented and illustrates how to develop and evaluate analog ICs for today's expanding wireless and mobile markets. Practical examples and end-of-chapter review questions reinforce important concepts and techniquesdeveloped in this cutting-edge guide.

LEARN HOW TO:

Evaluate power-supply systemsPredict and specify how linear regulators perform and respond to variations in their supplies, loads, and other working conditionsWork with semiconductor devices--resistors, capacitors, diodes, and transistorsCombine microelectronic components to design current mirrors, differential pairs, differential amplifiers, linear low-dropout regulators, and their variantsClose and stabilize feedback control loops that regulate voltages and currentsDesign circuits that establish reliable bias currents and reference circuitsDetermine the small-signal dynamics of analog ICs and analog systemsEstablish independent, stable, noise-free, and predictable power-supply voltagesImplement overcurrent, thermal, reverse-battery, and ESD protectionTest, measure, and evaluate linear regulator ICs