Microtechnology and MEMS – serie

Capillary Forces in Microassembly discusses the use of capillary forces as a gripping principle in microscale assembly. Clearly written and well-organized, this text brings together physical concepts at the microscale with practical applications in micromanipulation. Throughout this work, the reader will find a review of the existing gripping principles, elements to model capillary forces as well as descriptions of the simulation and experimental test bench developed to study the design parameters. Using well-known concepts from surface science (such as surface tension, capillary effects, wettability, and contact angles) as inputs to mechanical models, the amount of effort required to handle micro-components is predicted. These developments are then applied in a case study concerning the pick and place of balls in a watch ball bearing.Researchers and engineers involved in micromanipulation and precision assembly will find this a highly useful reference for microassembly system design and analysis.

Capillary Forces in Microassembly discusses the use of capillary forces as a gripping principle in microscale assembly. Clearly written and well-organized, this text brings together physical concepts at the microscale with practical applications in micromanipulation. Throughout this work, the reader will find a review of the existing gripping principles, elements to model capillary forces as well as descriptions of the simulation and experimental test bench developed to study the design parameters. Using well-known concepts from surface science (such as surface tension, capillary effects, wettability, and contact angles) as inputs to mechanical models, the amount of effort required to handle micro-components is predicted. These developments are then applied in a case study concerning the pick and place of balls in a watch ball bearing.Researchers and engineers involved in micromanipulation and precision assembly will find this a highly useful reference for microassembly system design and analysis.

This book presents the basics and methods of nanoscale analytical techniques for tribology field. It gives guidance to the application of mechanical, microstructural, chemical characterization methods and topography analysis of materials. It provides an overview of the of state-of-the-art for researchers and practitioners in the field of tribology. It shows different examples to the application of mechanical, microstructural, chemical characterization methods and topography analysis of materials. Friction and Wear phenomena are  governed by complexe processes at the interface of sliding surfaces. For a detailed understanding of these phenomena many surface sensitive techniques have become available in recent years. The applied methods are atom probe tomography, in situ TEM, SERS, NEXAFS, in situ XPS, nanoindentation and in situ Raman spectroscopy. A survey of new related numerical calculations completes this book. This concerns ab-initio coupling, numerical calculations for mechanical aspects and density functional theory (DFT) to study chemical reactivity.

Co-authored by the discoverer of the piezotronic effect, this book is a fundamental and comprehensive survey of piezotronics and piezo-phototronics.

Co-authored by the discoverer of the piezotronic effect, this book is a fundamental and comprehensive survey of piezotronics and piezo-phototronics.

Electroacoustic transducers (EAT) are devices, which transform electric energy to energy of acoustic fluctuations. Principles of action, design of transducers for work in air and water as well as for non-destructive control are described in the book. New technologies of designing EAT, not only expanding designing possibilities, are described. They also allow to create transducers with improved characteristics. In particular, methods to increase target capacity (sound pressure), decrease working (resonant) frequency of transducers and expand frequencies of projectors and sound receivers are developed. Methods and control units of transducers in batch production of transducers are described, too.

Electroacoustic transducers (EAT) are devices, which transform electric energy to energy of acoustic fluctuations. Principles of action, design of transducers for work in air and water as well as for non-destructive control are described in the book. New technologies of designing EAT, not only expanding designing possibilities, are described. They also allow to create transducers with improved characteristics. In particular, methods to increase target capacity (sound pressure), decrease working (resonant) frequency of transducers and expand frequencies of projectors and sound receivers are developed. Methods and control units of transducers in batch production of transducers are described, too.

This book presents the basics and methods of nanoscale analytical techniques for tribology field. The applied methods are atom probe tomography, in situ TEM, SERS, NEXAFS, in situ XPS, nanoindentation and in situ Raman spectroscopy.

This is the first book to address modelling of systems that are important to the fabrication of three-dimensional microstructures. It is unique in that it focuses on high aspect ratio microtechnology, ranging from ion beam micromachining to x-ray lithography.

This book addresses the use of MEMS and micromachined devices for the investigation of nanoscience and technology, as well as biotechnology. Such micromachined tools for nanotechnology can enhance the sensitivity, spatial resolution, dexterity, selectivity, and parallel processing capability in measuring and manipulating nano-objects. The book covers state-of-the-art MEMS and NEMS devices for DNA molecular handling and analysis, cell handling and culture on a chip, chemical lab-on-a-chip, multi-probes for vacuum tunneling microscopy and AFM, and characterization of quantum semiconductor structures. Readers will gain deep insight into such developments and students will learn about the emerging field of MEMS and nanotechnology.

Since the beginning of the nineties, shape memory alloys (SMA) have become available for microsystems technology. Currently the breadth of research and development activities on SMA microactuators ranges from pure scientific topics of materials research to technological problems, such as micromachining, integration and contacting. The book gives an overview of recent achievements, describing the development of microvalves and linear actuators comprehensively from concept through prototype. Further key aspects included are three-dimensional models for handling complex SMA actuator geometries and coupled simulation routines that take multifunctional properties into account. Mechanical and thermal optimization criteria are introduced for actuator design, allowing an optimum use of the shape memory effect. It is shown that some of the prototypes presented, e.g. SMA microgrippers, already outperform conventional components.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.

This book provides a comprehensive treatment of the very interdisciplinary ?eld of CMOS technology-based chemical microsensor systems. It is, on the one hand, targeted at scientists and engineers interested in getting ?rst - sights in the ?eld of chemical sensing since all necessary fundamental kno- edgeisincluded.Ontheotherhand,italsoaddressesexpertsinthe?eldsince it provides detailed information on all important issues related to realizing chemicalmicrosensorsand,speci?cally,chemicalmicrosensorsinCMOSte- nology. A large number of sensor and integrated-sensor-system implemen- tionsillustratethecurrentstateoftheartandhelptoidentifythepossibilities for future developments. Since microsensors produce "microsignals", sensor miniaturization without sensor integration is in many cases prone to failure. This book will help to reveal the bene?ts of using integrated electronics and CMOS-technology for developing chemical microsensor systems and, in p- ticular, the advantages that result from realizing monolithically integrated sensor systems comprising transducers and associated circuitry on a single chip.After a brief introduction, the fundamentals of chemical sensing are laid out,includingashortexcursionintotherelatedthermodynamicsandkinetics. Fabrication and processing steps that are commonly used in semiconductor industry are then abstracted. These more fundamental sections are followed by a short description of microfabrication techniques and the CMOS s- strateandmaterials.Thereafter,acomprehensiveoverviewofsemiconduct- based and CMOS-based transducer structures for chemical sensors is given.

This is the most comprehensive book on the basics, realization and applications of micromechanical photonics. Its purpose is to give the engineering student and the practical engineer a systematic introduction to optical MEMS (Micro electro mechanical systems) and micromechanical photonics. It does this not only through theoretical and experimental results, but also by describing various products and their fields of application.

An important aim of the presented book is the explanation of the application of piezoelectric materials such as piezoceramics within the wide field of electromechanical actuators and sensor technology. The reader should be presented the physical and mechanical properties of piezoceramics in a distinct way. In a next step, the reader is introduced into the mechanical description of the static behavior of piezoelectric multilayer beam bending actuators. The description of the dynamic behavior of piezoelectric multilayered bending actuators is effected on the basis of Lagrange‘s formalism and Hamilton‘s principle. The achieved insights are used for the systematic development of the electromechanical circuit representation within the scope of the network theory for any design of piezoelectric bending actuators. The applications of piezoelectric multilayer beam bending actuators can be extended by means of special displacement sensors allowing for the compensation of effects such as hysteresis, creep and drift being typical for piezoelectric actuators. Within the scope of the presented book, two different sensor-actuator-systems are presented being based on an integrated capacitive and inductive displacement sensor, respectively. Analytical simulations of the static and dynamic behavior are compared to real measurement results of a specially developed piezoelectric multilayer beam bender. Here, the suitability of the developed theoretical aspects is shown in an outstanding way.

Fast Simulation of Electro-Thermal MEMS provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. Emphasis is placed on the application of the Arnoldi method for effective order reduction of thermal systems. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.

There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

Laser Diode Microsystems provides the reader with the basic knowledge and understanding required for using semiconductor laser diodes in optical microsystems and micro-optical electromechanic systems. This tutorial addresses the fundamentals of semiconductor laser operation and design, coupled with an overview of the types of laser diodes suitable for use in Microsystems, along with their distinguishing characteristics. Emphasis is placed on laser diode characterization and measurement as well as the assembly techniques and optical accessories required for incorporation of semiconductor lasers into complex microsystems. Equipped with typical results and calculation examples, this hand-on text helps readers to develop a feel for how to choose a laser diode, characterize it and incorporate it into a microsystem.

This book introduces the use of industrial CMOS processes to produce arrays of nanomechanical cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of physical quantities such as forces and mass changes. The book is divided into three parts. First fabrication aspects and the mechanisms of cantilever resonators are introduced. Of the possible driving and sensing mechanisms, electrothermal and magnetic excitation, as well as piezoresistive detection and the use of MOS transistors for the deflection detection are introduced. This is followed by two application examples: The use of resonant cantilevers for the mass-sensitive detection of volatile organic compounds, and force sensor arrays for parallel Scanning Atomic Force Microscopy (AFM) of large areas.

This book provides a comprehensive description of microsensors for mechanical quantities (flow, pressure, force, inertia) fabricated by silicon micromachining. Since the design of such sensors requires interdisciplinary teamwork, the presentation is made accessible to engineers trained in electrical and mechanical engineering, physics and chemistry. The reader is guided through the micromachining fabrication process. A chapter on microsensor packaging completes the discussion of technological problems. The description of the basic physics required for sensor design includes the mechanics of deformation and the piezoresistive transduction to electrical signals. There is also a comprehensive discussion of resonant sensors, the hydrodynamics and heat transfer relevant for flow sensors, and, finally, electronic interfacing and readout circuitry. Numerous up-to-date case studies are presented, together with the working, fabrication and design of the sensors.

The first comprehensive text on microhotplate-based chemical sensor systems in CMOS-technology covers all aspects of successful sensor prototyping: theoretical considerations for modelling, controller- and system design, simulation of circuits and microsensors, design considerations, microfabrication, packaging and testing. A whole family of metal-oxide based microsensor systems with increasing complexity is presented, including fully integrated sensor arrays. This represents one of the first examples of integrated nanomaterials, microtechnology and embedded circuitry.

Beginning with an overview of nanomachining, this monograph introduces the relevant concepts from solid-state physics, thermodynamics, and lattice structures. It then covers modeling of thermal transport at the nanoscale and details simulations of different processes relevant to nanomachining. The final chapter summarizes the important points and discusses directions for future work to improve the modeling of nanomachining.

This is the first book to address modelling of systems that are important to the fabrication of three-dimensional microstructures. It is unique in that it focuses on high aspect ratio microtechnology, ranging from ion beam micromachining to x-ray lithography.

Since the beginning of the nineties, shape memory alloys (SMA) have become available for microsystems technology. Currently the breadth of research and development activities on SMA microactuators ranges from pure scientific topics of materials research to technological problems, such as micromachining, integration and contacting. The book gives an overview of recent achievements, describing the development of microvalves and linear actuators comprehensively from concept through prototype. Further key aspects included are three-dimensional models for handling complex SMA actuator geometries and coupled simulation routines that take multifunctional properties into account. Mechanical and thermal optimization criteria are introduced for actuator design, allowing an optimum use of the shape memory effect. It is shown that some of the prototypes presented, e.g. SMA microgrippers, already outperform conventional components.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

As the deep-ultraviolet (DUV) laser technology continues to mature, an increasing number of industrial and manufacturing applications are emerging. For example, the new generation of semiconductor inspection systems is being pushed to image at increasingly shorter DUV wavelengths to facilitate inspection of deep sub-micron features in integrated circuits. DUV-sensitive charge-coupled device (CCD) cameras are in demand for these applications. Although CCD cameras that are responsive at DUV wavelengths are now available, their long-term stability is still a major concern. This book describes the degradation mechanisms and long-term performance of CCDs in the DUV, along with new results of device performance at these wavelengths.

This book provides a comprehensive treatment of the very interdisciplinary ?eld of CMOS technology-based chemical microsensor systems. It is, on the one hand, targeted at scientists and engineers interested in getting ?rst - sights in the ?eld of chemical sensing since all necessary fundamental kno- edgeisincluded.Ontheotherhand,italsoaddressesexpertsinthe?eldsince it provides detailed information on all important issues related to realizing chemicalmicrosensorsand,speci?cally,chemicalmicrosensorsinCMOSte- nology. A large number of sensor and integrated-sensor-system implemen- tionsillustratethecurrentstateoftheartandhelptoidentifythepossibilities for future developments. Since microsensors produce "microsignals", sensor miniaturization without sensor integration is in many cases prone to failure. This book will help to reveal the bene?ts of using integrated electronics and CMOS-technology for developing chemical microsensor systems and, in p- ticular, the advantages that result from realizing monolithically integrated sensor systems comprising transducers and associated circuitry on a single chip.After a brief introduction, the fundamentals of chemical sensing are laid out,includingashortexcursionintotherelatedthermodynamicsandkinetics. Fabrication and processing steps that are commonly used in semiconductor industry are then abstracted. These more fundamental sections are followed by a short description of microfabrication techniques and the CMOS s- strateandmaterials.Thereafter,acomprehensiveoverviewofsemiconduct- based and CMOS-based transducer structures for chemical sensors is given.

This is the most comprehensive book on the basics, realization and applications of micromechanical photonics. Its purpose is to give the engineering student and the practical engineer a systematic introduction to optical MEMS (Micro electro mechanical systems) and micromechanical photonics. It does this not only through theoretical and experimental results, but also by describing various products and their fields of application.