Frontiers in Electronic Testing – serie

This book grew out of an attempt to describe a variety of tools that were developed over a period of years in IBM to analyze Integrated Circuit fail data. The selection presented in this book focuses on those tools that have a significant statistical or datamining component. The danger of describing sta­ tistical analysis methods is the amount of non-trivial mathematics that is involved and that tends to obscure the usually straigthforward analysis ideas. This book is, therefore, divided into two roughly equal parts. The first part contains the description of the various analysis techniques and focuses on ideas and experimental results. The second part contains all the mathematical details that are necessary to prove the validity of the analysis techniques, the existence of solutions to the problems that those techniques engender, and the correctness of several properties that were assumed in the first part. Those who are interested only in using the analysis techniques themselves can skip the second part, but that part is important, if only to understand what is being done.

System on Chip (SOC) having both digital and analog circuits has become increasingly prevalent in integrated circuit manufacturing industry. Electronic tests are classified as digital, analog and mixed signal. Current methodologies for the testing of digital circuits are well developed. In contrast, methodologies for the testing of analog circuits remain relatively underdeveloped due to the complex nature of analog signals. Compared to digital testing, analog testing lags far behind in methodologies and tools and therefore demands substantial research and development effort.Fault Diagnosis of Analog Integrated Circuits is a textbook for advanced undergraduate and graduate level students as well as practicing engineers. The objective of this book is to study the testing and fault diagnosis of analog and analog part of mixed signal circuits. A background in analog integrated circuit, artificial neural network is desirable but not essential.The text covers the testing and fault diagnosis of both bipolar and Metal Oxide Semiconductor (MOS) circuits. Fault model of the devices in analog domain has been introduced in the text. The test stimulus generations are also discussed in details. Experimental verification of some state of the art techniques has also been presented in the book. It also contains problems that can be used as quiz or homework. This book enables the reader to test an analog circuit that is implemented either in bipolar or MOS technology.

Advances in Electronic Testing: Challenges and Methodologies is a new type of edited volume in the Frontiers in Electronic Testing book series devoted to recent advances in electronic circuits testing. The book is a comprehensive elaboration on important topics which capture major research and development efforts today. The motivation and inspiration behind this book is to deliver a thorough text that focuses on the evolution of test technology, provides insight about the abiding importance of discussed topics, records today’s state of the art and industrial practices and trends, reveals the challenges for emerging testing methodologies, and envisages the future of this journey.The book consists of eleven edited chapters written by experts in Defect-Oriented Testing, Nanometer Technologies Failures and Testing, Silicon Debug, Delay Testing, High-Speed Test Interfaces, DFT-Oriented Low-Cost Testers, Embedded Cores and System-on-Chip Testing, Memory Testing, Mixed-Signal Testing, RF Testing and Loaded Board Testing. Contributing authors are affiliated with (in alphabetical order) Agilent, ARM, Balearic Islands Univ., IBM, Inovys, Intel, LogicVision, Magma, Mentor Graphics, New Mexico Univ., Sandia National Labs, Synopsys, Teradyne and Texas Instruments.Advances in Electronic Testing: Challenges and Methodologies is an advanced textbook and reference point for senior undergraduate and graduate students in MSc or PhD tracks, professors and research leaders in the electronic testing domain. It is also for industry design and test engineers and managers seeking a global view and understanding of test technology practices and methodologies and a dense elaboration on test-related issues they face in their development projects."There is a definite need for documenting the advances in testing … I find the work of this edited volume by Dimitris Gizopoulos and his team of authors to be significant and timely. […] the book provides, besidesnovel test methodologies, a collective insight into the emerging aspects of testing. This, I think, is beneficial to practicing engineers and researchers both of whom must stay at the forefront of technology. […] This latest addition to the Frontiers Series is destined to serve an important role." From the Foreword by Vishwani D. Agrawal, Consulting Editor, Frontiers in Electronic Testing Book Series.

In the early to mid-1990's while working at what was then Motorola Se- conductor, business changes forced my multi-hundred dollar microprocessor to become a tens-of-dollars embedded core. I ran into first hand the problem of trying to deliver what used to be a whole chip with something on the order of over 400 interconnect signals to a design team that was going to stuff it into a package with less than 220 signal pins and surround it with other logic. I also ran into the problem of delivering microprocessor specification verifi- tion – a microprocessor is not just about the functions and instructions included with the instruction set, but also the MIPs rating at some given f- quency. I faced two dilemmas: one, I could not deliver functional vectors without significant development of off-core logic to deal with the reduced chip I/O map (and everybody's I/O map was going to be a little different); and two, the JTAG (1149. 1) boundary scan ring that was around my core when it was a chip was going to be woefully inadequate since it did not support - speed signal application and capture and independent use separate from my core. I considered the problem at length and came up with my own solution that was predominantly a separate non-JTAG scan test wrapper that supported at-speed application of launch-capture cycles using the system clock. But my problems weren't over at that point either.

Fault-tolerance in integrated circuits is not an exclusive concern regarding space designers or highly-reliable application engineers. Rather, designers of next generation products must cope with reduced margin noises due to technological advances. The continuous evolution of the fabrication technology process of semiconductor components, in terms of transistor geometry shrinking, power supply, speed, and logic density, has significantly reduced the reliability of very deep submicron integrated circuits, in face of the various internal and external sources of noise. The very popular Field Programmable Gate Arrays, customizable by SRAM cells, are a consequence of the integrated circuit evolution with millions of memory cells to implement the logic, embedded memories, routing, and more recently with embedded microprocessors cores. These re-programmable systems-on-chip platforms must be fault-tolerant to cope with present days requirements. This book discusses fault-tolerance techniques for SRAM-based Field Programmable Gate Arrays (FPGAs). It starts by showing the model of the problem and the upset effects in the programmable architecture. In the sequence, it shows the main fault tolerance techniques used nowadays to protect integrated circuits against errors. A large set of methods for designing fault tolerance systems in SRAM-based FPGAs is described. Some presented techniques are based on developing a new fault-tolerant architecture with new robustness FPGA elements. Other techniques are based on protecting the high-level hardware description before the synthesis in the FPGA. The reader has the flexibility of choosing the most suitable fault-tolerance technique for its project and to compare a set of fault tolerant techniques for programmable logic applications.

As many circuits and applications now enter the Gigahertz frequency range, accurate digital timing measurements have become crucial in the design, verification, characterization, and application of electronic circuits. To be successful in this endeavour, an engineer needs a knowledge base covering instrumentation, measurement techniques, signal integrity, jitter and timing concepts, and statistics. Very often even the most experienced digital test engineers, while mastering some of those subjects, lack systematic knowledge or experience in the high speed signal area.Digital Timing Measurements gives a compact, practice-oriented overview on all those subjects. The emphasis is on useable concepts and real-life guidelines that can be readily put into practice, with references to the underlying mathematical theory. It unites in one place a variety of information relevant to high speed testing, measurement, signal fidelity, and instrumentation.

Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.

Emerging Nanotechnologies: Test, Defect Tolerance and Reliability covers various technologies that have been developing over the last decades such as chemically assembled electronic nanotechnology, Quantum-dot Cellular Automata (QCA), and nanowires and carbon nanotubes. Each of these technologies offers various advantages and disadvantages. Some suffer from high power, some work in very low temperatures and some others need indeterministic bottom-up assembly. These emerging technologies are not considered as a direct replacement for CMOS technology and may require a completely new architecture to achieve their functionality.Emerging Nanotechnologies: Test, Defect Tolerance and Reliability brings all of these issues together in one place for readers and researchers who are interested in this rapidly changing field.

This title explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP) cores, which is becoming increasingly popular. Since tests for pre-designed cores can be supplied with the cores themselves, the only additional tests that need to be developed to test and diagnose the entire system are those for wire interconnects between the cores. Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution.The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP.

Today's electronic design and test engineers deal with several types of subsystems, namely, digital, memory, and mixed-signal, each requiring different test and design for testability methods. This book provides a careful selection of essential topics on all three types of circuits. The outcome of testing is product quality, which means "meeting the user's needs at a minimum cost". The book includes test economics and techniques for determining the defect level of VLSI chips. Besides being a textbook for a course on testing, it is a complete testability guide for an engineer working on any kind of electronic device or system or a system-on-a-chip.

Test functions (fault detection, diagnosis, error correction, repair, etc.) that are applied concurrently while the system continues its intended function are defined as on-line testing. In its expanded scope, on-line testing includes the design of concurrent error checking subsystems that can be themselves self-checking, fail-safe systems that continue to function correctly even after an error occurs, reliability monitoring, and self-test and fault-tolerant designs. This text contains a selected set of articles that discuss many of the modern aspects of on-line testing as faced today. The contributions are largely derived from recent IEEE international on-line testing workshops.

This text covers two major topics in design verification: logic equivalence checking and design debugging. The first part of the book reviews the design problems that require logic equivalence checking and describes the underlying technologies that are used to solve them. Some novel approaches to the problems of verifying design revisions after intensive sequential transformations such as retiming are described in detail. The second part of the book gives a thorough survey of previous and recent literature on design error diagnosis and design error correction. This part also provides an in-depth analysis of the algorithms used in two logic debugging software programs, ErrorTracer and AutoFix, developed by the authors. With the adoption of the static sign-off approach to verifying circuit implementations the application-specific integrated circuit (ASIC) industry will experience the first radical methodological revolution since the adoption of logic synthesis. Equivalence checking is one of the two critical elements of this methodological revolution.This book is intended for the designer seeking to better understand the mechanics of equivalence checking or for the CAD researcher who wishes to investigate well-motivated research problems such as equivalence checking of retimed designs or error diagnosis in sequential circuits.

System approaches embody the partitioning of problems into smaller inter-related subsystems that will be solved together. Thus, words like hierarchical, dependence, inference, model, and partitioning are frequent throughout this text. Each of the authors deals with the complexity issue in a similar fashion, but the real value in a collected work such as this is in the subtle differences that may lead to synthesized approaches that allow even more progress. The works included in this volume are an outgrowth of the 2nd International Workshop on System Test and Diagnosis held in Alexandria, Virginia in April 1998. The first such workshop was held in Freiburg, Germany, six years earlier. In the current workshop nearly 50 experts from around the world struggled over issues concerning the subject. In this volume, a group of workshop participants was invited to provide a chapter that expanded their workshop presentations and incorporated their workshop interactions. While we have attempted to present the work as one volume and requested some revision to the work, the content of the individual chapters was not edited significantly.Consequently, the reader should see different approaches to solving the same problems and occasional disagreement between authors as to definitions or the importance of factors.

With the ever-increasing speed of integrated circuits, violations of the performance specifications are becoming a major factor affecting the product quality level. The need for testing timing defects is further expected to grow with the late 20th-century design trend of moving towards deep submicron devices. After a long period of prevailing belief that high stuck-at fault coverage is sufficient to guarantee high quality of shipped products, the industry is now forced to rethink other types of testing. Delay testing has been a topic of extensive research both in industry and in academia for more than a decade. As a result, several delay fault models and numerous testing methodologies have been proposed. Presenting a selection of existing delay testing research results, this volume combines introductory material with state-of-the-art techniques that address some of the problems in delay testing in the late 1990s. This text covers some basic topics such as fault modelling and test application schemes for detecting delay defects. It also presents summaries and conclusions of several recent case studies and experiments related to delay testing.A selection of delay testing issues and test techniques such as delay fault simulation, test generation, design for testability and synthesis for testability are also covered. The book is intended for use by CAD and test engineers, researchers, tool developers and graduate students. It requires a basic background in digital testing. It can also be used as supplementary material for a graduate-level course on VLSI testing.

This reference offers practical and proven design-for-testability (DFT) solutions to chip and system design engineers, test engineers and product managers at the silicon level as well as at the board and systems levels. Designers will see how the implementation of embedded test enables simplification of silicon debug and system bring-up. Test engineers will determine how embedded test provides a superior level of at-speed test, diagnosis and measurement without exceeding the capabilities of their equipment. Product managers will learn how the time, resources and costs associated with test development, manufacture cost and lifecycle maintenance of their products can be significantly reduced by designing embedded test in the product. A complete design flow and analysis of the impact of embedded test on a design aims to help solve problems before any DFT is attempted.

The "Mixed-Signal Boundary-Scan Test Bus" is the natural complement to the widely used "Boundary-Scan IEEE Std. 1149.1", commonly known as JTAG. This new mixed-signal standard is called "IEEE Standard 1149.4" and is mainly dedicated to the manufacturing test of analog and mixed-signal boards. But like the IEEE 1149.1 it can be used for many other purposes: the test buses and their digital control form a very general "analog data highway". Increasingly, mixed-signal boards are gaining complexity, making their testing process extremely challenging. At the same time, IC complexity and technology are getting so sophisticated that testing ICs at the board level becomes very expensive. Embedding a part of the board tester on chip is the aim of the IEEE 1149.4. This is a treatment of the design, application and structure of the IEEE 1149.4. It updates the information on digital boundary-scan and addresses chip designers in a dedicated chapter containing guidance to easily build analog circuits including IEEE 1149.4. A basic metrology and a test strategy with the instrumentation needed for it are also described.

This volume considers testability aspects for digital ICs. The strategy taken is to integrate the testability aspects into the design and manufacturing of ICs and, for each IC design project, to give a precise definition of the boundary conditions, responsibilities, interfaces and communications between persons, and quality targets. Macro Test, a design-for-testability approach, provides a manageable test-programme route. Using the Macro Test approach, one can explore alternative solutions to satisfy pre-defined levels of performance (such as defect detection, defect location, test application) within a pre-defined cost budget and time scale. This book presents a tried and proven method of using a Macro approach to testing complex ICs and is intended for all test engineers, IC designers and managers concerned with producing high quality ICs.

Branch-and-bound search has been known for a long time and has been widely used in solving a variety of problems in computer-aided design (CAD) and many important optimization problems. In many applications, the classic branch-and-bound search methods perform duplications of computations, or rely on the search decision trees which keep track of the branch-and-bound search processes. In CAD and many other technical fields, the computational cost of constructing branch-and-bound search decision trees in solving large-scale problems is prohibitive and duplications of computations are intolerable. Efficient branch-and-bound methods are needed to deal with today's computational challenges. Efficient branch-and-bound methods must not duplicate computations. This volume describes an efficient branch-and-bound method for logic justification, which is fundamental to automatic test pattern generation (ATPG), redundancy identification, logic synthesis, minimization, verification and other problems in CAD. The method is called justification equivalence, based on the observation that justification processes may share identical subsequent search decision sequences.With justification equivalence, duplication of computations is avoided in the dynamic branch-and-bound search process without using search decision trees. This book consists of two parts. The first part, containing the first three chapters, provides the theoretical work. The second part deals with applications, particularly ATPG for sequential circuits. This book is intended, in particular, for those readers who are interested in the design and testing of digital circuits.

Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing.This volume focuses on the core of the interface between manufacturing and testing - the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate the probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modelling and design manufacturing.

Multi-chips modules (MCMs) in the late 1990s consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. This volume of research presents updated test strategies for MCMs. It is designed for engineers interested in practical implementations of MCM test solutions and for designers seeking current test and design-for-testability solutions for their next designs.

This volume provides a detailed treatment of current research in algorithmic techniques for logic synthesis, test generation and formal verification of digital circuits. It presents the central idea of approaching design automation problems for logic-level circuits by specific Boolean reasoning techniques. While Boolean reasoning techniques have been a central element of two-level circuit theory for many decades this book describes a basic reasoning methodology for multi-level circuits. This leads to a unified view on two-level and multi-level logic synthesis. The presented reasoning techniques are applied to various CAD-problems to demonstrate their usefulness for today's industrially relevant problems. The author provides descriptions of basic algorithmic concepts in automatic test pattern generation, logic synthesis and verification and elaborates their intimate relationship to provide further intuition and insight into the subject. Numerous examples are provide for ease in understanding the material.The text is intended for researchers in logic synthesis, VLSI testing and formal verification as well as for integrated circuit designers who want to enhance their understanding of basic CAD methodologies.

Testing techniques for VLSI circuits are undergoing many changes. The predominant method for testing digital circuits consists of applying a set of input stimuli to the IC and monitoring the logic levels at primary outputs. If, for one or more inputs, there is a discrepancy between the observed output and the expected output then the IC is declared to be defective. A new approach to testing digital circuits, which has come to be known as IDDQ testing, has been actively researched for the last 15 years. In IDDQ testing, the steady state supply current, rather than the logic levels at the primary outputs, is monitored. Years of research suggests that IDDQ testing can significantly improve the quality and reliability of fabricated circuits. This has prompted many semiconductor manufacturers to adopt this testing technique, among them Philips Semiconductors, Ford Microelectronics, Intel, Texas Instruments, LSI Logic, Hewlett-Packard, SUN microsystems, Alcatel, and SGS Thomson. This increase in the use of IDDQ testing should be of interest to three groups of individuals associated with the IC business: Product Managers and Test Engineers, CAD Tool Vendors and Circuit Designers.Introduction to IDDQ Testing is designed to educate this community. The authors have summarized in one volume the main findings of more than 15 years of research in this area.

Embedded Processor-Based Self-Test is a guide to self-testing strategies for embedded processors. Embedded processors are regularly used today in most System-on-Chips (SoCs). Testing of microprocessors and embedded processors has always been a challenge because most traditional testing techniques fail when applied to them. This is due to the complex sequential structure of processor architectures, which consists of high performance datapath units and sophisticated control logic for performance optimization. Structured Design-for-Testability (DfT) and hardware-based self-testing techniques, which usually have a non-trivial impact on a circuit’s performance, size and power, can not be applied without serious consideration and careful incorporation into the processor design.Embedded Processor-Based Self-Test shows how the powerful embedded functionality that processors offer can be utilized as a self-testing resource. Through a discussion of different strategies the book emphasizes on the emerging area of Software-Based Self-Testing (SBST). SBST is based on the idea of execution of embedded software programs to perform self-testing of the processor itself and its surrounding blocks in the SoC. SBST is a low-cost strategy in terms of overhead (area, speed, power), development effort and test application cost, as it is applied using low-cost, low-speed test equipment.Embedded Processor-Based Self-Test can be used by designers, DfT engineers, test practitioners, researchers and students working on digital testing, and in particular processor and SoC test. This book sets the framework for comparisons among different SBST methodologies by discussing key requirements. It presents successful applications of SBST to a number of embedded processors of different complexities and instruction set architectures.

SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications. The first part covers an introduction into test problems including faults, fault types, design-flow, design-for-test techniques such as scan-testing and Boundary Scan. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling. Finally, the third part focuses on SOC applications, such as integrated test scheduling and TAM design, defect-oriented scheduling, and integrating test design with the core selection process.

This book presents the development and experimental validation of the structural test strategy called Oscillation-Based Test -- OBT in short. The results presented here assert, not only from a theoretical point of view, but also based on a wide experimental support, that OBT is an efficient defect-oriented test solution, complementing the existing functional test techniques for mixed-signal circuits.

A recent technological advance is the art of designing circuits to test themselves, referred to as a Built-In Self-Test (BIST). This idea was first proposed around 1980 and has grown to become one of the most important testing techniques at the current time, as well as for the future. This book is written from a designer's perspective and describes the major BIST approaches that have been proposed and implemented since 1980, along with their advantages and limitations. The BIST approaches include the Built-In Logic Block Observer, pseudo-exhaustive BIST techniques, Circular BIST, scan-based BIST, BIST for regular structures, BIST for FPGAs and CPLDs, mixed-signal BIST, and the integration of BIST with concurrent fault detection techniques for on-line testing. Particular attention is paid to system-level use of BIST in order to maximize the benefits of BIST through reduced testing time and cost as well as high diagnostic resolution. The author spent 15 years as a designer at Bell Labs where he designed over 20 production VLSI devices and 3 production circuit boards. Sixteen of the VLSI devices contained BIST of various types for regular structures and general sequential logic, including the first BIST for Random Access Memories (RAMs), the first completely self-testing integrated circuit, and the first BIST for mixed-signal systems at Bell Labs. He has spent the past 10 years in academia where his research and development continues to focus on BIST, including the first BIST for FPGAs and CPLDs along with continued work in the area of BIST for general sequential logic and mixed-signal systems. He holds 10 US patents (with 5 more pending) for various types of BIST approaches. Therefore, the author brings a unique blend of knowledge and experience to this practical guide for designers, test engineers, product engineers, system diagnosticians, and managers.

This work explores test resource partitioning and optimization techniques for plug-and-play system-on-a-chip (SOC) test automation. Plug-and-play refers to the paradigm in which core-to-core interfaces as well as core-to-SOC logic interfaces are standardized, such that cores can be easily plugged into "virtual sockets" on the SOC design, and core tests can be plugged into the SOC during test without substantial effort on the part of the system integrator. The goal of the book is to position test resource partitioning in the context of SOC test automation, as well as to generate interest and motivate research on this important topic. SOC integrated circuits composed of embedded cores are commonplace. Nevertheless, There remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design, and test challenges are a major contributor to the widening gap between design capability and manufacturing capacity. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. This text responds to a pressing need for a structured methodology for SOC test automation.It presents new techniques for the partitioning and optimization of the three major SOC test resources: test hardware, testing time and test data volume. It aims to pave the way for a powerful integrated framework to automate the test flow for a large number of cores in an SOC in a plug-and-play fashion. The framework presented allows the system integrator to reduce test cost and meet short time-to-market requirements.

System-on-a-Chip (SOC) integrated circuits composed of embedded cores are now commonplace. Nevertheless, there remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design and manufacturing capabilities. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols. In addition, long interconnects, high density, and high-speed designs lead to new types of faults involving crosstalk and signal integrity. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation is an edited work containing thirteen contributions that address various aspects of SOC testing. SOC (System-on-a-Chip) Testing for Plug and Play Test Automation, originally published as Volume 18, Issues 4 and 5, of the Journal of Electronic Testing, is a valuable reference for researchers and students interested in various aspects of SOC testing.

Minimization of power dissipation in very large scale integrated (VLSI) circuits is important to improve reliability and reduce packaging costs. While many techniques have investigated power minimization during the functional (normal) mode of operation, it is important to examine the power dissipation during the test circuit activity is substantially higher during test than during functional operation. For example, during the execution of built-in self-test (BIST) in-field sessions, excessive power dissipation can decrease the reliability of the circuit under test due to higher temperature and current density. This text focuses on techniques for minimizing power dissipation during test application at logic and register-transfer levels of abstraction of the VLSI design flow. The first part of this book surveys the existing techniques for power constrained testing of VLSI circuits. In the second part, several test automation techniques for reducing power in scan-based sequential circuits and BIST data paths are presented.